XA3S250E-4FTG256I
XA3S250E-4FTG256I
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rohs

AMD Xilinx

XA3S250E-4FTG256I


XA3S250E-4FTG256I
F20-XA3S250E-4FTG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FTBGA-256
LEAD FREE, FTBGA-256

XA3S250E-4FTG256I ECAD Model


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XA3S250E-4FTG256I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 172
Number of Outputs 132
Number of Logic Cells 5508
Number of Equivalent Gates 250000
Number of CLBs 612
Combinatorial Delay of a CLB-Max 4.88 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Screening Level AEC-Q100
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 612 CLBS, 250000 GATES
Clock Frequency-Max 572 MHz
Power Supplies 1.2,1.2/3.3,2.5 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 1.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FTBGA-256
Pin Count 256
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XA3S250E-4FTG256I Datasheet Download


XA3S250E-4FTG256I Overview



The chip model XA3S250E-4FTG256I is a highly advanced piece of technology developed by the renowned semiconductor company Xilinx. It is a Field Programmable Gate Array (FPGA) that is designed to provide a wide range of functions and capabilities. It is capable of handling a variety of tasks, from digital signal processing to encryption and decryption.


The original design intention of the XA3S250E-4FTG256I was to provide a platform for high-performance computing that can be used in a wide range of fields. It is capable of performing multiple functions simultaneously and can be used in a variety of applications. It is also capable of being upgraded in the future to further expand its capabilities.


The XA3S250E-4FTG256I is a great choice for advanced communication systems. It can be used to power high-speed networks and can be used to increase the efficiency of data transmission. It can also be used to secure data transmissions and protect networks from malicious attacks. It is also capable of being used in the development and popularization of future intelligent robots.


The XA3S250E-4FTG256I can also be used in the era of fully intelligent systems. It can be used to create intelligent scenarios that are capable of recognizing patterns and making decisions based on those patterns. It can also be used to create intelligent robots that are capable of performing complex tasks. To use the model effectively, technical talents such as software engineers, computer scientists, and electrical engineers are needed.


Overall, the XA3S250E-4FTG256I is a powerful and versatile chip model that can be used in a variety of applications. It is capable of being upgraded in the future to further expand its capabilities and can be used to power advanced communication systems, create intelligent scenarios, and develop and popularize future intelligent robots. Technical talents are needed to use the model effectively, but with the right expertise, the chip model can be used to great effect.



1,900 In Stock


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Unit Price: $71.1805
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $66.1979 $66.1979
10+ $65.4861 $654.8606
100+ $61.9270 $6,192.7035
1000+ $58.3680 $29,184.0050
10000+ $53.3854 $53,385.3750
The price is for reference only, please refer to the actual quotation!

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