XA3S200A-4FTG256Q

The XA3S200A-4FTG256Q is a high-performance, low-power, field-programmable gate array (FPGA) chip manufactured by Xilinx. This device is designed to meet the needs of a wide range of applications, including embedded systems, communications, medical, industrial, and consumer markets. It is comprised of 200,000 logic cells, 4,096 digital signal processing (DSP) slices, and 256-bit block RAMs.

This FPGA chip is built using a 28nm process technology, and is capable of operating at up to 1.2V. It has a maximum power consumption of 4.5W, and a maximum operating temperature of 85°C. The chip is equipped with a wide range of features, including differential I/O, high-speed transceivers, memory controllers, and a variety of other peripherals. Its enhanced I/O capabilities allow for high-speed communication, while its low-power design makes it suitable for battery-powered applications.

The XA3S200A-4FTG256Q is designed to provide high performance, low power, and high reliability. It is capable of supporting a wide range of applications, including embedded systems, communications, medical, industrial, and consumer markets. It is also ideal for applications that require high-speed data transfer and high-performance computing. This FPGA chip is also capable of supporting a variety of programming languages, such as Verilog, VHDL, and SystemVerilog. In addition, it is compatible with a variety of software development tools, such as Xilinx Vivado and Xilinx ISE.