AMD Xilinx
XA3S200-4VQG100Q
XA3S200-4VQG100Q ECAD Model
XA3S200-4VQG100Q Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 173 | |
| Number of Outputs | 173 | |
| Number of Logic Cells | 4320 | |
| Number of Equivalent Gates | 200000 | |
| Number of CLBs | 480 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | AEC-Q100 | |
| Temperature Grade | AUTOMOTIVE | |
| Package Shape | SQUARE | |
| Organization | 480 CLBS, 200000 GATES | |
| Clock Frequency-Max | 125 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LEAD FREE, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XA3S200-4VQG100Q Datasheet Download
XA3S200-4VQG100Q Overview
The chip model XA3S200-4VQG100Q is an important element in the development of modern technology and its applications. It is a versatile chip model that can be used in a wide range of applications, from communication systems to intelligent robots. As such, it has a great potential for future development.
In terms of industry trends, the chip model XA3S200-4VQG100Q is on the cutting edge of technology. It is designed to be highly efficient, reliable, and secure, and it has the capability to support a wide range of technologies. As the demand for more powerful and sophisticated technologies increases, the chip model XA3S200-4VQG100Q can be upgraded to meet the requirements of the application environment.
The original design intention of the chip model XA3S200-4VQG100Q is to provide a reliable and secure platform for communication systems and other applications. Its versatility allows it to be used in a variety of applications, ranging from consumer electronics to industrial automation. The chip model also has the potential to be used in the development and popularization of future intelligent robots. In order for the chip model XA3S200-4VQG100Q to be effectively used in the development of intelligent robots, it is important that the right technical talents are employed.
In conclusion, the chip model XA3S200-4VQG100Q is a versatile and reliable chip model that can be used in a variety of applications. It has the potential to be upgraded to meet the requirements of the application environment and to be used in the development and popularization of future intelligent robots. In order to use the model effectively, it is important to have the right technical talents on board.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||