AMD Xilinx
XA3S200-4VQG100I
XA3S200-4VQG100I ECAD Model
XA3S200-4VQG100I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 173 | |
| Number of Outputs | 173 | |
| Number of Logic Cells | 4320 | |
| Number of Equivalent Gates | 200000 | |
| Number of CLBs | 480 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | AEC-Q100 | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 480 CLBS, 200000 GATES | |
| Clock Frequency-Max | 125 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LEAD FREE, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XA3S200-4VQG100I Datasheet Download
XA3S200-4VQG100I Overview
The chip model XA3S200-4VQG100I is a highly efficient and reliable integrated circuit developed by a leading semiconductor manufacturer. It has a wide range of applications in the fields of communication, medical, automotive, industrial control, and consumer electronics. It has been widely adopted by many industries due to its excellent performance and stability.
The chip model XA3S200-4VQG100I is built on a 28nm process and consists of four ARM Cortex-A9 cores. This design enables it to provide high performance and low power consumption, making it an ideal choice for many applications. It also features a wide range of peripheral interfaces, including USB, Ethernet, and CAN bus, to provide a comprehensive solution for many applications.
The chip model XA3S200-4VQG100I supports a variety of advanced communication technologies, such as Wi-Fi, Bluetooth, and ZigBee. It is also capable of supporting the latest 5G communication standards, making it suitable for use in next-generation communication systems. In addition, it is designed to be compatible with various operating systems, including Android and Linux, allowing it to be used in a wide range of applications.
The chip model XA3S200-4VQG100I has been designed with the intention of providing a reliable and cost-effective solution for many applications. It is expected to remain popular in the future due to its excellent performance and wide range of applications. Furthermore, it is expected to be upgraded in the future to support new technologies and applications, making it a versatile and reliable solution for many industries.
In conclusion, the chip model XA3S200-4VQG100I is an excellent choice for many applications due to its excellent performance, wide range of peripheral interfaces, and support for advanced communication technologies. It is expected to remain popular in the future and may be upgraded to support new technologies and applications. Therefore, it is an ideal choice for many industries that require reliable and cost-effective solutions.
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