XA3S200-4TQG144Q

The XA3S200-4TQG144Q is a field-programmable gate array (FPGA) chip designed by Xilinx, Inc. It is a mid-range, low-cost device that is suitable for a wide range of applications.

The XA3S200-4TQG144Q chip has 200,000 logic cells, and it is built on a 0.4-micron CMOS process. It has a total of 4,320 flip-flops, 144 I/O blocks, and a total of 384 I/O pins. It also has two dedicated clock pins, two dedicated reset pins, and two dedicated configuration pins. The chip has a maximum operating frequency of 200 MHz, and it is capable of delivering up to 1.2 Gbps of data throughput.

The XA3S200-4TQG144Q is designed to be used in a wide range of applications, including embedded systems, communications, data acquisition, industrial control, and consumer electronics. It is also suitable for use in applications that require high-speed signal processing and high-speed data transmission.

The XA3S200-4TQG144Q is designed to be highly reliable and is backed by a five-year warranty. It is also designed to be easy to use and program, and it is compatible with the Xilinx ISE development environment. The chip also features a number of advanced features, such as programmable logic blocks, distributed RAM, and built-in test capability.

Overall, the XA3S200-4TQG144Q is a reliable, low-cost FPGA chip that is suitable for a wide range of applications. It is designed to be easy to use and program, and it is backed by a five-year warranty. It is capable of delivering up to 1.2 Gbps of data throughput, and it features a number of advanced features, such as programmable logic blocks, distributed RAM, and built-in test capability.