
AMD Xilinx
XA3S200-4TQG144I
XA3S200-4TQG144I ECAD Model
XA3S200-4TQG144I Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Automotive, AEC-Q100, Spartan®-3 XA | |
Package | Tray | |
Number of LABs/CLBs | 480 | |
Number of Logic Elements/Cells | 4320 | |
Total RAM Bits | 221184 | |
Number of I/O | 97 | |
Number of Gates | 200000 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 144-LQFP | |
Supplier Device Package | 144-TQFP (20x20) | |
Base Product Number | XA3S200 |
XA3S200-4TQG144I Datasheet Download
XA3S200-4TQG144I Overview
The XA3S200-4TQG144I is a high-performance, low-power FPGA chip from Xilinx. It is based on the Xilinx Spartan-3E architecture and includes 200K logic cells and up to 144 I/O pins. It is designed to be used in a wide variety of applications, including embedded systems, communications, industrial automation, and medical imaging.
The XA3S200-4TQG144I features a clock frequency of up to 200MHz, a power consumption of up to 1.2W, and a maximum operating temperature of 85°C. It is equipped with advanced features such as an integrated 8-bit microcontroller, an integrated high-speed serial transceiver, and a high-speed DSP block. It also includes a wide range of I/O options, including LVDS, PCIe, and USB.
The XA3S200-4TQG144I is designed to be used in a wide range of applications, including embedded systems, communications, industrial automation, and medical imaging. It is particularly well-suited for applications that require high-performance, low-power, and high-density solutions. In addition, its high-speed serial transceiver and integrated 8-bit microcontroller make it ideal for applications that require high-speed communication and data processing.
Overall, the XA3S200-4TQG144I is a powerful, low-power FPGA chip that is designed to be used in a wide variety of applications. Its advanced features and wide range of I/O options make it an ideal choice for applications that require high-performance, low-power, and high-density solutions.
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