XA3S200-4TQG144I
XA3S200-4TQG144I
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AMD Xilinx

XA3S200-4TQG144I


XA3S200-4TQG144I
F20-XA3S200-4TQG144I
Active
IC FPGA 97 I/O 144TQFP
144-TQFP (20x20)

XA3S200-4TQG144I ECAD Model


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XA3S200-4TQG144I Attributes


Type Description Select
Mfr AMD Xilinx
Series Automotive, AEC-Q100, Spartan®-3 XA
Package Tray
Number of LABs/CLBs 480
Number of Logic Elements/Cells 4320
Total RAM Bits 221184
Number of I/O 97
Number of Gates 200000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 144-LQFP
Supplier Device Package 144-TQFP (20x20)
Base Product Number XA3S200

XA3S200-4TQG144I Datasheet Download


XA3S200-4TQG144I Overview



The XA3S200-4TQG144I is a high-performance, low-power FPGA chip from Xilinx. It is based on the Xilinx Spartan-3E architecture and includes 200K logic cells and up to 144 I/O pins. It is designed to be used in a wide variety of applications, including embedded systems, communications, industrial automation, and medical imaging.


The XA3S200-4TQG144I features a clock frequency of up to 200MHz, a power consumption of up to 1.2W, and a maximum operating temperature of 85°C. It is equipped with advanced features such as an integrated 8-bit microcontroller, an integrated high-speed serial transceiver, and a high-speed DSP block. It also includes a wide range of I/O options, including LVDS, PCIe, and USB.


The XA3S200-4TQG144I is designed to be used in a wide range of applications, including embedded systems, communications, industrial automation, and medical imaging. It is particularly well-suited for applications that require high-performance, low-power, and high-density solutions. In addition, its high-speed serial transceiver and integrated 8-bit microcontroller make it ideal for applications that require high-speed communication and data processing.


Overall, the XA3S200-4TQG144I is a powerful, low-power FPGA chip that is designed to be used in a wide variety of applications. Its advanced features and wide range of I/O options make it an ideal choice for applications that require high-performance, low-power, and high-density solutions.



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