XA3S200-4FTG256I
XA3S200-4FTG256I
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rohs

AMD Xilinx

XA3S200-4FTG256I


XA3S200-4FTG256I
F20-XA3S200-4FTG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, LEAD FREE, FTBGA-256
LEAD FREE, FTBGA-256

XA3S200-4FTG256I ECAD Model


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XA3S200-4FTG256I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 173
Number of Outputs 173
Number of Logic Cells 4320
Number of Equivalent Gates 200000
Number of CLBs 480
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Screening Level AEC-Q100
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Organization 480 CLBS, 200000 GATES
Clock Frequency-Max 125 MHz
Power Supplies 1.2,1.2/3.3,2.5 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 1.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FTBGA-256
Pin Count 256
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XA3S200-4FTG256I Datasheet Download


XA3S200-4FTG256I Overview



The XA3S200-4FTG256I is a Field Programmable Gate Array (FPGA) chip model manufactured by Xilinx. It is a high-performance, low-power FPGA with a small form factor. It is designed for applications that require high-speed data processing and low-power consumption.


The XA3S200-4FTG256I chip has a capacity of 256K logic cells and 4 million system gates. It has a power consumption of less than 1.5W and a maximum operating frequency of 200 MHz. The chip also features high-speed differential I/O, up to 8 Gbps, and up to 32 LVDS I/O pairs. It comes with on-chip memory blocks, including a 64-bit block RAM and a 32-bit distributed RAM.


The XA3S200-4FTG256I chip is suitable for a variety of applications, including embedded systems, industrial automation, medical imaging, automotive, networking, and communications. It is also suitable for applications that require high-speed data processing and low-power consumption.


Overall, the XA3S200-4FTG256I is a high-performance, low-power FPGA chip model from Xilinx. It is suitable for a variety of applications that require high-speed data processing and low-power consumption. It has a capacity of 256K logic cells and 4 million system gates and a power consumption of less than 1.5W. It also features high-speed differential I/O, up to 8 Gbps, and up to 32 LVDS I/O pairs.



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Unit Price: $25.6002
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Pricing (USD)

QTY Unit Price Ext Price
1+ $23.8082 $23.8082
10+ $23.5522 $235.5218
100+ $22.2722 $2,227.2174
1000+ $20.9922 $10,496.0820
10000+ $19.2002 $19,200.1500
The price is for reference only, please refer to the actual quotation!

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