
AMD Xilinx
XA3S200-4FTG256I
XA3S200-4FTG256I ECAD Model
XA3S200-4FTG256I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 173 | |
Number of Outputs | 173 | |
Number of Logic Cells | 4320 | |
Number of Equivalent Gates | 200000 | |
Number of CLBs | 480 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Screening Level | AEC-Q100 | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 480 CLBS, 200000 GATES | |
Clock Frequency-Max | 125 MHz | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 1.55 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FTBGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XA3S200-4FTG256I Datasheet Download
XA3S200-4FTG256I Overview
The XA3S200-4FTG256I is a Field Programmable Gate Array (FPGA) chip model manufactured by Xilinx. It is a high-performance, low-power FPGA with a small form factor. It is designed for applications that require high-speed data processing and low-power consumption.
The XA3S200-4FTG256I chip has a capacity of 256K logic cells and 4 million system gates. It has a power consumption of less than 1.5W and a maximum operating frequency of 200 MHz. The chip also features high-speed differential I/O, up to 8 Gbps, and up to 32 LVDS I/O pairs. It comes with on-chip memory blocks, including a 64-bit block RAM and a 32-bit distributed RAM.
The XA3S200-4FTG256I chip is suitable for a variety of applications, including embedded systems, industrial automation, medical imaging, automotive, networking, and communications. It is also suitable for applications that require high-speed data processing and low-power consumption.
Overall, the XA3S200-4FTG256I is a high-performance, low-power FPGA chip model from Xilinx. It is suitable for a variety of applications that require high-speed data processing and low-power consumption. It has a capacity of 256K logic cells and 4 million system gates and a power consumption of less than 1.5W. It also features high-speed differential I/O, up to 8 Gbps, and up to 32 LVDS I/O pairs.
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1,485 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $23.8082 | $23.8082 |
10+ | $23.5522 | $235.5218 |
100+ | $22.2722 | $2,227.2174 |
1000+ | $20.9922 | $10,496.0820 |
10000+ | $19.2002 | $19,200.1500 |
The price is for reference only, please refer to the actual quotation! |