XA3S1600E-FGG400

The XA3S1600E-FGG400 is a reconfigurable field-programmable gate array (FPGA) chip developed by Microsemi Corporation. It is based on the latest ProASIC3L family of FPGAs, which are designed to provide high-performance, low-power, and cost-effective solutions for a wide range of applications.

The XA3S1600E-FGG400 chip is a low-cost, low-power, and high-performance device that offers a wide range of features. It has a total of 16,000 logic elements, including 1,600 flip-flops, and 4,000 I/O pins. It also features a high-speed clock distribution network, a high-speed interconnect system, and a wide range of configurable options.

The XA3S1600E-FGG400 chip is suitable for a wide range of applications, including embedded systems, industrial control systems, medical devices, aerospace applications, and automotive systems. It can be used for high-speed data processing, signal processing, and control applications. It also offers a wide range of features, such as programmable logic, memory, and I/O.

The XA3S1600E-FGG400 chip is a reliable, cost-effective, and low-power solution for a wide range of applications. It offers high performance, low power consumption, and a wide range of features, making it an ideal choice for embedded systems, industrial control systems, medical devices, aerospace applications, and automotive systems.