XA3S1600E-4FG484I

The XA3S1600E-4FG484I is a low-power, high-performance FPGA (Field Programmable Gate Array) chip developed by Xilinx. It is based on the Xilinx Spartan-3E family of FPGAs and is manufactured using their advanced low-power 0.13-micron process technology. It is available in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package and has a maximum operating temperature of 85°C.

The chip features 1600 logic cells, with up to 18 Kbits of RAM and up to 200 Kbits of distributed RAM. It also has up to 8 DSP slices, with up to 16 multipliers and 48-bit accumulators. The chip also has up to 4 dedicated clock management tiles and up to 8 dedicated I/O tiles. The I/O tiles support a variety of protocols, including LVDS, LVCMOS, and PCI Express.

The XA3S1600E-4FG484I is suitable for a wide range of applications, including consumer electronics, automotive, industrial, medical, and aerospace. It is suitable for applications such as image processing, video decoding, motor control, and communications. It can also be used for digital signal processing, embedded control, and system-on-chip (SoC) designs.

Overall, the XA3S1600E-4FG484I is a low-power, high-performance FPGA chip that is suitable for a variety of applications. It features a wide range of features, including 1600 logic cells, up to 18 Kbits of RAM, up to 200 Kbits of distributed RAM, up to 8 DSP slices, up to 4 dedicated clock management tiles, and up to 8 dedicated I/O tiles.