XA3S1500-TGG676

The XA3S1500-TGG676 is an FPGA (Field Programmable Gate Array) chip manufactured by Xilinx. It is a member of the Spartan-3 family and is designed for high-density applications. It has a maximum operating frequency of 150MHz and a total of 1,536 logic cells. It has a power supply voltage of 1.2V and a maximum power dissipation of 3.5W.

The chip is designed with a range of features, including high performance and low power consumption. It also has enhanced I/O capabilities, including up to 48 differential I/O pairs and up to 144 single-ended I/O pairs. The chip also features advanced system-level integration capabilities, including an integrated PowerPC processor, an integrated DSP block, and an integrated memory controller.

The XA3S1500-TGG676 is suitable for a variety of applications, including embedded systems, industrial automation, automotive, medical, and consumer electronics. It can be used for a range of tasks, such as image processing, signal processing, and communication. It is also suitable for applications that require high performance and low power consumption.

Overall, the XA3S1500-TGG676 is a powerful and versatile FPGA chip that can be used in a wide range of applications. It offers high performance, low power consumption, and advanced system-level integration capabilities, making it an ideal choice for embedded systems, industrial automation, automotive, medical, and consumer electronics applications.