XA3S1500-4FGG676C

The XA3S1500-4FGG676C is a low-power and high-performance FPGA (Field Programmable Gate Array) chip model designed by Xilinx. This model is based on the XA architecture and is designed to meet the requirements of various applications ranging from consumer electronics, industrial automation, and medical products to aerospace and defense systems.

The XA3S1500-4FGG676C model is available in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package and offers a wide range of features and capabilities. It has a total of 1,500K logic cells and is capable of processing up to 250MHz of clock frequency. It also supports multiple I/O standards, including LVDS, LVCMOS, and SSTL. The device also features an array of dedicated logic blocks, including DSP slices, Block RAM, and Memory Interfaces.

In terms of power consumption, the XA3S1500-4FGG676C operates at a maximum power of 3.9W and has a standby power of 0.2W. It also supports a wide range of operating temperatures from -40°C to +85°C.

Overall, the XA3S1500-4FGG676C is an ideal chip model for applications that require high-performance and low-power consumption. It is suitable for a wide range of applications such as consumer electronics, industrial automation, medical products, aerospace and defense systems, and more.