AMD Xilinx
XA3S1200E-4FTG256I
XA3S1200E-4FTG256I ECAD Model
XA3S1200E-4FTG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 190 | |
| Number of Outputs | 150 | |
| Number of Logic Cells | 19512 | |
| Number of Equivalent Gates | 1200000 | |
| Number of CLBs | 2168 | |
| Combinatorial Delay of a CLB-Max | 4.88 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | AEC-Q100 | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2168 CLBS, 1200000 GATES | |
| Clock Frequency-Max | 572 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FTBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XA3S1200E-4FTG256I Datasheet Download
XA3S1200E-4FTG256I Overview
The XA3S1200E-4FTG256I is a Field Programmable Gate Array (FPGA) chip designed by Xilinx. It is a member of the Spartan-3E family of FPGAs, and is based on a 90nm process technology. It has a total of 4,272 logic cells, which can be configured to implement various digital circuits. It also features 256Mb of embedded memory, which can be used to store data and program code.
The chip has a total of 4,272 logic cells, with each cell containing four input Look-Up Tables (LUTs) and two Flip-Flops (FFs). It also has a total of 8,544 I/O pins, which can be used to connect to external devices. The chip has a total power dissipation of 4.5W, and a maximum operating frequency of 200MHz.
The XA3S1200E-4FTG256I is primarily used in applications such as industrial automation, consumer electronics, automotive systems, and medical devices. It is also suitable for use in applications such as high-speed data acquisition, image processing, and video processing. Additionally, it can be used to implement various digital logic circuits, such as adders, multipliers, and comparators.
Overall, the XA3S1200E-4FTG256I is a powerful and versatile FPGA chip that can be used in a wide range of applications. It offers a high level of flexibility and performance, making it an ideal choice for embedded systems and other digital logic applications.
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3,806 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $52.6008 | $52.6008 |
| 10+ | $52.0352 | $520.3520 |
| 100+ | $49.2072 | $4,920.7200 |
| 1000+ | $46.3792 | $23,189.6000 |
| 10000+ | $42.4200 | $42,420.0000 |
| The price is for reference only, please refer to the actual quotation! | ||