XA3S1200E-4FFG256Q

The XA3S1200E-4FFG256Q is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It is a member of the Spartan-3E family of FPGAs. It is a low-cost, low-power device with a maximum operating temperature of 125°C. The device is packaged in a 256-pin FineLine BGA package and is available in both commercial and industrial temperature ranges.

The XA3S1200E-4FFG256Q has a maximum capacity of over 120,000 system gates and up to 2.5 Mbits of embedded memory. It also features up to 1,200 I/O pins, up to 24 dedicated clock lines and up to 16 dedicated configuration pins. The device also supports up to four banks of dedicated RAM blocks and up to 16 DSP slices.

The XA3S1200E-4FFG256Q is suitable for a wide range of applications including digital signal processing, embedded computing, networking, automotive, industrial and consumer applications. It is also suitable for applications such as image processing, video processing, medical imaging and a range of other applications.

The XA3S1200E-4FFG256Q offers a number of features that make it an attractive choice for a wide range of applications. It is designed to be highly configurable and offers a high level of integration, which reduces the number of components needed for a given application. It also offers high-speed performance, low power consumption and a wide operating temperature range. Additionally, the XA3S1200E-4FFG256Q is designed to be compatible with a range of development tools, allowing for easy integration into existing systems.