AMD Xilinx
XA3S100E-4VQG100I
XA3S100E-4VQG100I ECAD Model
XA3S100E-4VQG100I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 66 | |
| Number of Outputs | 59 | |
| Number of Logic Cells | 2160 | |
| Number of Equivalent Gates | 100000 | |
| Number of CLBs | 240 | |
| Combinatorial Delay of a CLB-Max | 4.88 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | AEC-Q100 | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 240 CLBS, 100000 GATES | |
| Clock Frequency-Max | 572 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LEAD FREE, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XA3S100E-4VQG100I Datasheet Download
XA3S100E-4VQG100I Overview
The XA3S100E-4VQG100I is a Field Programmable Gate Array (FPGA) chip from Xilinx. It is a low-cost, low-power, high-performance device that is suitable for a variety of applications. It is based on the Spartan-3E architecture, and is fabricated using a 0.13-micron process.
The chip has a total of 100,000 system gates, and is capable of operating at a maximum clock frequency of 200 MHz. It includes a total of 4,096 logic cells, which can be used for implementing logic functions. It also includes 8,192 bits of distributed RAM, and 4,096 bits of dedicated RAM. Additionally, it features 48 user I/O pins, and 10 dedicated I/O pins.
The XA3S100E-4VQG100I is suitable for a variety of applications, including embedded systems, digital signal processing, and communications systems. It is also suitable for applications in industrial, automotive, aerospace, and medical fields.
In terms of power consumption, the XA3S100E-4VQG100I is designed to be highly efficient. It has a maximum power consumption of 2.5 W at 25°C, and a maximum power dissipation of 1.2 W. It also features a power-down mode, which allows it to reduce its power consumption to as low as 0.1 W.
Overall, the XA3S100E-4VQG100I is a low-cost, low-power, high-performance FPGA chip from Xilinx. It is suitable for a variety of applications, including embedded systems, digital signal processing, and communications systems. It is also highly efficient, with a maximum power consumption of 2.5 W and a maximum power dissipation of 1.2 W.
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3,467 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $13.0721 | $13.0721 |
| 10+ | $12.9315 | $129.3152 |
| 100+ | $12.2287 | $1,222.8720 |
| 1000+ | $11.5259 | $5,762.9600 |
| 10000+ | $10.5420 | $10,542.0000 |
| The price is for reference only, please refer to the actual quotation! | ||