XA3S1000-4FTG256Q
XA3S1000-4FTG256Q
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AMD Xilinx

XA3S1000-4FTG256Q


XA3S1000-4FTG256Q
F20-XA3S1000-4FTG256Q
Active
IC FPGA 173 I/O 256FTBGA
256-FTBGA (17x17)

XA3S1000-4FTG256Q ECAD Model


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XA3S1000-4FTG256Q Attributes


Type Description Select
Mfr AMD Xilinx
Series Automotive, AEC-Q100, Spartan®-3 XA
Package Tray
Number of LABs/CLBs 1920
Number of Logic Elements/Cells 17280
Total RAM Bits 442368
Number of I/O 173
Number of Gates 1000000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 125°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FTBGA (17x17)
Base Product Number XA3S1000

XA3S1000-4FTG256Q Datasheet Download


XA3S1000-4FTG256Q Overview



The XA3S1000-4FTG256Q is a low-power, high-performance FPGA chip manufactured by Xilinx. It is a member of the Spartan-3 family of FPGAs, and is designed to provide a wide range of features and functions in a single package.


The XA3S1000-4FTG256Q has a total of 256k logic cells, with 4 million system gates. It is capable of delivering up to 250MHz of system performance, with a maximum power consumption of only 2.8W. It also includes a variety of features such as up to 4,096 bits of RAM, up to 32Kbits of flash memory, up to 16 dedicated high-speed I/O blocks, and up to 8 dedicated PLLs.


The XA3S1000-4FTG256Q is suitable for a wide range of applications, including embedded control, digital signal processing, video and image processing, automotive, industrial automation, medical, and aerospace. It is also suitable for use in high-speed networking and communications, as well as in consumer and mobile applications.


The XA3S1000-4FTG256Q is designed to provide a high level of flexibility and performance, while also being cost-effective. It is also highly reliable and is designed to provide a long life cycle. It is also easy to use and configure, making it an ideal choice for a wide range of applications.



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