AMD Xilinx
XA3S1000-4FG456Q
XA3S1000-4FG456Q ECAD Model
XA3S1000-4FG456Q Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 391 | |
| Number of Outputs | 391 | |
| Number of Logic Cells | 17280 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 1920 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | AEC-Q100 | |
| Temperature Grade | AUTOMOTIVE | |
| Package Shape | SQUARE | |
| Organization | 1920 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 125 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XA3S1000-4FG456Q Datasheet Download
XA3S1000-4FG456Q Overview
The XA3S1000-4FG456Q is a Field Programmable Gate Array (FPGA) chip from Xilinx. It is a low-cost, low-power device that can be used in a variety of applications. It has a total of 4,096 logic cells, which are divided into two logic blocks. It also has 256Kbits of on-chip RAM, four dedicated DSP slices and eight dedicated multipliers.
The chip is designed to be used in a wide range of applications. It has a wide range of I/O capabilities, including LVDS, LVCMOS, SSTL and HSTL. It also supports various high-speed transceivers, including PCIe, SATA, USB, and Ethernet. It also has a range of integrated peripherals, such as timers, counters, and PWM.
The chip is designed to be used in a wide range of applications, including embedded systems, industrial automation, medical equipment, and automotive applications. It is also well-suited for use in high-performance computing applications, such as artificial intelligence, machine learning, and video processing.
The XA3S1000-4FG456Q is a highly configurable device, with a range of options for configuring the logic cells, RAM, DSP slices, and multipliers. It also has a range of development tools, including a range of reference designs, software libraries, and design tools.
Overall, the XA3S1000-4FG456Q is a powerful, low-cost, low-power FPGA chip that can be used in a wide range of applications. It has a wide range of I/O capabilities, integrated peripherals, and development tools, making it an ideal choice for a variety of applications.
You May Also Be Interested In
2,394 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $117.4278 | $117.4278 |
| 10+ | $116.1651 | $1,161.6509 |
| 100+ | $109.8518 | $10,985.1768 |
| 1000+ | $103.5384 | $51,769.2240 |
| 10000+ | $94.6998 | $94,699.8000 |
| The price is for reference only, please refer to the actual quotation! | ||