
Microchip Technology Inc
SY58609UMGTR
SY58609UMGTR ECAD Model
SY58609UMGTR Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Propagation Delay (tpd) | 450 ps | |
Number of Functions | 1 | |
Number of Inputs | 2 | |
Number of Outputs | 1 | |
Surface Mount | YES | |
Package Code | HVQCCN | |
Family | 58609 | |
Logic IC Type | LOW SKEW CLOCK DRIVER | |
Additional Feature | IT CAN ALSO OPERATE WITH 3.3 VOLT SUPPLY | |
fmax-Min | 2.5 GHz | |
Input Conditioning | DIFFERENTIAL MUX | |
Number of True Outputs | 2 | |
Output Polarity | COMPLEMENTARY | |
Power Supply Current-Max (ICC) | 60 mA | |
Same Edge Skew-Max (tskwd) | 20 ps | |
Supply Voltage-Max (Vsup) | 2.625 V | |
Supply Voltage-Min (Vsup) | 2.375 V | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | S-XQCC-N16 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e4 | |
Moisture Sensitivity Level | 2 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 16 | |
Package Body Material | UNSPECIFIED | |
Package Equivalence Code | LCC16,.12SQ,20 | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Packing Method | TR | |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
Terminal Form | NO LEAD | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Seated Height-Max | 900 µm | |
Width | 3 mm | |
Length | 3 mm | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Part Package Code | DFN | |
Package Description | HVQCCN, LCC16,.12SQ,20 | |
Pin Count | 16 | |
Manufacturer Package Code | MLF | |
Reach Compliance Code | compliant | |
ECCN Code | 5A991.B.1 | |
HTS Code | 8542.39.00.01 |
SY58609UMGTR Datasheet Download
SY58609UMGTR Overview
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