Microchip Technology Inc
SY58605UMGTR
SY58605UMGTR ECAD Model
SY58605UMGTR Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Propagation Delay (tpd) | 420 ps | |
| Prop. Delay@Nom-Sup | 420 ps | |
| Number of Functions | 1 | |
| Surface Mount | YES | |
| Package Code | HVSON | |
| Family | 58605 | |
| Logic IC Type | LOW SKEW CLOCK DRIVER | |
| fmax-Min | 2 GHz | |
| Input Conditioning | DIFFERENTIAL | |
| Number of True Outputs | 2 | |
| Power Supply Current-Max (ICC) | 50 mA | |
| Supply Voltage-Max (Vsup) | 2.625 V | |
| Supply Voltage-Min (Vsup) | 2.375 V | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | S-PDSO-N8 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e4 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | SOLCC8,.08,20 | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Packing Method | TR | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 500 µm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 900 µm | |
| Width | 2 mm | |
| Length | 2 mm | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | HVSON, SOLCC8,.08,20 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | DFN | |
| Pin Count | 8 | |
| Manufacturer Package Code | MLF |
SY58605UMGTR Datasheet Download
SY58605UMGTR Overview
Microchip Technology Inc offers a wide range of electronic components for various applications, and one such component is the SY58605UMGTR. This component can be purchased from FMALL, a reputable supplier of electronic components.
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