M7AFS600-FGG256I
M7AFS600-FGG256I
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rohs

Microchip Technology Inc

M7AFS600-FGG256I


M7AFS600-FGG256I
F8-M7AFS600-FGG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA
LBGA

M7AFS600-FGG256I ECAD Model


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M7AFS600-FGG256I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.5 V
Number of Equivalent Gates 600000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 600000 GATES
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer MICROSEMI CORP
Package Description LBGA,
Reach Compliance Code compliant
HTS Code 8542.39.00.01

M7AFS600-FGG256I Datasheet Download


M7AFS600-FGG256I Overview



The M7AFS600-FGG256I is a low-power, low-cost, 256-bit field-programmable gate array (FPGA) chip from Microsemi Corporation. It is based on the Actel Fusion architecture, which enables the chip to provide high-performance, low-power, and low-cost solutions for a wide range of applications. The chip is designed to provide flexible, cost-effective solutions for applications such as embedded systems, communications, industrial automation, and consumer electronics.


The M7AFS600-FGG256I features a total of 256 logic elements, which are capable of providing up to 16.4 million logic gates. It also includes up to 576 Kbits of embedded block RAM, and up to 1 Mbit of embedded flash memory. The chip also features a wide range of I/O options, including LVDS, LVCMOS, and SSTL I/O standards. It also supports a variety of clock sources, including an internal oscillator, external clock source, and PLL.


The M7AFS600-FGG256I is designed to be used in applications requiring high performance, low power, and low cost. It is suitable for a variety of applications, such as embedded systems, communications, industrial automation, and consumer electronics. The chip is also designed to be used in a wide range of environments, including automotive, aerospace, and medical applications. The chip is also designed to be used in a wide range of temperatures, from -40°C to 125°C.


In summary, the M7AFS600-FGG256I is a low-power, low-cost, 256-bit FPGA chip from Microsemi Corporation. It features up to 16.4 million logic gates, up to 576 Kbits of embedded block RAM, and up to 1 Mbit of embedded flash memory. It is designed to be used in applications requiring high performance, low power, and low cost, and is suitable for a variety of applications, including embedded systems, communications, industrial automation, and consumer electronics.



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Unit Price: $304.716
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Pricing (USD)

QTY Unit Price Ext Price
1+ $283.3859 $283.3859
10+ $280.3387 $2,803.3872
100+ $265.1029 $26,510.2920
1000+ $249.8671 $124,933.5600
10000+ $228.5370 $228,537.0000
The price is for reference only, please refer to the actual quotation!

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