
Microchip Technology Inc
M7AFS600-FGG256I
M7AFS600-FGG256I ECAD Model
M7AFS600-FGG256I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.5 V | |
Number of Equivalent Gates | 600000 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 600000 GATES | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | LBGA, | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
M7AFS600-FGG256I Datasheet Download
M7AFS600-FGG256I Overview
The M7AFS600-FGG256I is a low-power, low-cost, 256-bit field-programmable gate array (FPGA) chip from Microsemi Corporation. It is based on the Actel Fusion architecture, which enables the chip to provide high-performance, low-power, and low-cost solutions for a wide range of applications. The chip is designed to provide flexible, cost-effective solutions for applications such as embedded systems, communications, industrial automation, and consumer electronics.
The M7AFS600-FGG256I features a total of 256 logic elements, which are capable of providing up to 16.4 million logic gates. It also includes up to 576 Kbits of embedded block RAM, and up to 1 Mbit of embedded flash memory. The chip also features a wide range of I/O options, including LVDS, LVCMOS, and SSTL I/O standards. It also supports a variety of clock sources, including an internal oscillator, external clock source, and PLL.
The M7AFS600-FGG256I is designed to be used in applications requiring high performance, low power, and low cost. It is suitable for a variety of applications, such as embedded systems, communications, industrial automation, and consumer electronics. The chip is also designed to be used in a wide range of environments, including automotive, aerospace, and medical applications. The chip is also designed to be used in a wide range of temperatures, from -40°C to 125°C.
In summary, the M7AFS600-FGG256I is a low-power, low-cost, 256-bit FPGA chip from Microsemi Corporation. It features up to 16.4 million logic gates, up to 576 Kbits of embedded block RAM, and up to 1 Mbit of embedded flash memory. It is designed to be used in applications requiring high performance, low power, and low cost, and is suitable for a variety of applications, including embedded systems, communications, industrial automation, and consumer electronics.
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2,358 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $283.3859 | $283.3859 |
10+ | $280.3387 | $2,803.3872 |
100+ | $265.1029 | $26,510.2920 |
1000+ | $249.8671 | $124,933.5600 |
10000+ | $228.5370 | $228,537.0000 |
The price is for reference only, please refer to the actual quotation! |