M2GL025-1FCS325

The M2GL025-1FCS325 is a low-power, high-performance, radiation-hardened FPGA chip from the M2GL family of products from Microsemi. This device is designed for use in a wide range of mission-critical applications, including aerospace, defense, and industrial applications.

The M2GL025-1FCS325 features 25,000 logic elements, up to 1.6 million system gates, and up to 25,000 flip-flop registers. It also includes 8 DSP blocks, up to 8 high-speed SERDES channels, and up to 256 Kbits of embedded RAM. The device is designed to operate at a maximum speed of 500 MHz and is capable of operating over the full military temperature range.

The device is designed to be radiation-hardened, with a single-event latchup (SEL) immunity of up to 100 MeV/mg/cm2 and a single-event upset (SEU) immunity of up to 30 MeV/mg/cm2. It also has advanced power management features, such as dynamic voltage scaling, clock gating, and power-down modes, to help reduce power consumption and improve system performance.

The M2GL025-1FCS325 is designed for use in a wide range of mission-critical applications, including aerospace, defense, and industrial applications. It is ideal for applications such as data acquisition, control systems, and communications systems. Its radiation-hardened design makes it suitable for use in space applications and other harsh environments.