
Microchip Technology Inc
M2GL010TS-1FG484I
M2GL010TS-1FG484I ECAD Model
M2GL010TS-1FG484I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 233 | |
Number of Outputs | 233 | |
Number of Logic Cells | 12084 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Power Supplies | 1.2 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B484 | |
Qualification Status | Not Qualified | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.44 mm | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | BGA, BGA484,22X22,40 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
M2GL010TS-1FG484I Datasheet Download
M2GL010TS-1FG484I Overview
The M2GL010TS-1FG484I is a low power, high performance, multi-core chip model designed for embedded applications. It is a System-on-Chip (SoC) device that integrates multiple components and technologies into a single chip. It features an ARM Cortex-A9 processor core with two cores operating at up to 1GHz, a Mali-400MP2 GPU with two cores operating at up to 266MHz, and a memory controller with support for DDR3 and LPDDR2 memory. It also has a rich set of on-chip peripherals, including USB 2.0, Ethernet, UART, I2C, SPI, and GPIO.
The M2GL010TS-1FG484I is ideal for a variety of embedded applications, such as consumer electronics, automotive infotainment, industrial automation, and medical devices. It is capable of running multiple operating systems, including Linux, Android, and Windows Embedded Compact. It also supports a wide range of software development tools, such as the ARM DS-5 and Keil MDK-ARM development tools.
The chip is manufactured using a 28nm process and is available in a BGA package. It has a power consumption of less than 1.5W and supports a wide range of operating temperatures from -40°C to +85°C. It also has a high level of integration, with all components being integrated onto a single die. This reduces the cost and complexity of the design, allowing for a more compact and power-efficient system.
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1,122 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $153.4127 | $153.4127 |
10+ | $151.7631 | $1,517.6311 |
100+ | $143.5151 | $14,351.5113 |
1000+ | $135.2671 | $67,633.5590 |
10000+ | $123.7199 | $123,719.9250 |
The price is for reference only, please refer to the actual quotation! |