M2GL010TS-1FG484I
M2GL010TS-1FG484I
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rohs

Microchip Technology Inc

M2GL010TS-1FG484I


M2GL010TS-1FG484I
F8-M2GL010TS-1FG484I
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA, BGA484,22X22,40
BGA, BGA484,22X22,40

M2GL010TS-1FG484I ECAD Model


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M2GL010TS-1FG484I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.2 V
Number of Inputs 233
Number of Outputs 233
Number of Logic Cells 12084
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Power Supplies 1.2 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
Moisture Sensitivity Level 3
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.44 mm
Ihs Manufacturer MICROSEMI CORP
Package Description BGA, BGA484,22X22,40
Reach Compliance Code unknown
HTS Code 8542.39.00.01

M2GL010TS-1FG484I Datasheet Download


M2GL010TS-1FG484I Overview



The M2GL010TS-1FG484I is a low power, high performance, multi-core chip model designed for embedded applications. It is a System-on-Chip (SoC) device that integrates multiple components and technologies into a single chip. It features an ARM Cortex-A9 processor core with two cores operating at up to 1GHz, a Mali-400MP2 GPU with two cores operating at up to 266MHz, and a memory controller with support for DDR3 and LPDDR2 memory. It also has a rich set of on-chip peripherals, including USB 2.0, Ethernet, UART, I2C, SPI, and GPIO.


The M2GL010TS-1FG484I is ideal for a variety of embedded applications, such as consumer electronics, automotive infotainment, industrial automation, and medical devices. It is capable of running multiple operating systems, including Linux, Android, and Windows Embedded Compact. It also supports a wide range of software development tools, such as the ARM DS-5 and Keil MDK-ARM development tools.


The chip is manufactured using a 28nm process and is available in a BGA package. It has a power consumption of less than 1.5W and supports a wide range of operating temperatures from -40°C to +85°C. It also has a high level of integration, with all components being integrated onto a single die. This reduces the cost and complexity of the design, allowing for a more compact and power-efficient system.



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Unit Price: $164.9599
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Pricing (USD)

QTY Unit Price Ext Price
1+ $153.4127 $153.4127
10+ $151.7631 $1,517.6311
100+ $143.5151 $14,351.5113
1000+ $135.2671 $67,633.5590
10000+ $123.7199 $123,719.9250
The price is for reference only, please refer to the actual quotation!

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