Microchip Technology Inc
M1AFS250-1FGG256I
M1AFS250-1FGG256I ECAD Model
M1AFS250-1FGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 6144 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 250000 GATES | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.68 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | LBGA, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
M1AFS250-1FGG256I Datasheet Download
M1AFS250-1FGG256I Overview
The M1AFS250-1FGG256I is an embedded Flash memory chip from Macronix. It is a low-power, high-performance embedded non-volatile memory solution for a wide range of applications.
The chip features a 256Mb capacity and is built on a 1F process technology with a 1.8V voltage supply. It has a fast page read and write speed of up to 25MHz and a random read speed of up to 50MHz. The chip also has an embedded ECC engine with a programmable Error Correction Code (ECC) up to 32 bits/512 bytes. It also supports a wide range of commands and features an auto-boot function that allows the chip to boot up quickly.
The M1AFS250-1FGG256I is suitable for a wide range of embedded applications such as industrial, automotive, consumer electronics, and medical systems. It can be used for storing and executing code, data storage, and secure booting. The chip is also suitable for use in applications that require high reliability and data security such as automotive systems.
The M1AFS250-1FGG256I is compliant with the JEDEC standard and is RoHS compliant. It is available in a 44-pin TSOP package and is rated for operation from -40°C to +85°C. The chip is also available in an Extended Temperature range (ET) version that is rated for operation from -40°C to +125°C.
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1,534 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $241.9995 | $241.9995 |
| 10+ | $239.3973 | $2,393.9734 |
| 100+ | $226.3866 | $22,638.6615 |
| 1000+ | $213.3759 | $106,687.9450 |
| 10000+ | $195.1609 | $195,160.8750 |
| The price is for reference only, please refer to the actual quotation! | ||