Microchip Technology Inc
M1A3PE3000-FGG896I
M1A3PE3000-FGG896I ECAD Model
M1A3PE3000-FGG896I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 620 | |
| Number of Outputs | 620 | |
| Number of Logic Cells | 75264 | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 75264 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 75264 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 350 MHz | |
| Power Supplies | 1.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA896,30X30,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
M1A3PE3000-FGG896I Datasheet Download
M1A3PE3000-FGG896I Overview
The M1A3PE3000-FGG896I chip model is a programmable logic device (PLD) designed and manufactured by Altera Corporation. It is a high-density device with a capacity of up to 3000 logic elements, and is based on the MAX 3000A architecture. It is a member of the MAX family of PLDs, and is used in a variety of applications.
The device is fabricated using a 0.25um CMOS process, and has a power dissipation of 4.8W. It has a maximum operating frequency of 100MHz, and is capable of handling up to 72 I/O pins. It features a wide range of features, including a dedicated JTAG port, a dedicated configuration port, and a dedicated programming port.
The device is suitable for a wide range of applications, including industrial automation, consumer electronics, automotive, medical, aerospace, and telecommunications. It can be used in applications such as digital signal processing, data acquisition, image processing, and embedded control. It is also suitable for FPGA prototyping and system-on-chip (SoC) designs.
The device is available in a range of packages, including PBGA, PQFP, and BGA. It is also available in a range of densities, from 1000 to 3000 logic elements. It is also supported by a range of development tools, including Quartus II, Nios II, and MAX+Plus II.
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4,548 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,431.8858 | $1,431.8858 |
| 10+ | $1,416.4891 | $14,164.8913 |
| 100+ | $1,339.5060 | $133,950.6027 |
| 1000+ | $1,262.5229 | $631,261.4610 |
| 10000+ | $1,154.7466 | $1,154,746.5750 |
| The price is for reference only, please refer to the actual quotation! | ||