Microchip Technology Inc
M1A3PE3000-FGG896
M1A3PE3000-FGG896 ECAD Model
M1A3PE3000-FGG896 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 620 | |
| Number of Outputs | 620 | |
| Number of Logic Cells | 75264 | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 75264 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 75264 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 350 MHz | |
| Power Supplies | 1.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA896,30X30,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
M1A3PE3000-FGG896 Datasheet Download
M1A3PE3000-FGG896 Overview
The M1A3PE3000-FGG896 is a high-performance, low-power, multi-core processor from Intel. It is based on the Intel Atom microarchitecture and is designed for embedded and mobile applications. The chip is available in two versions, the M1A3PE3000-FGG896 and the M1A3PE3000-FGG896-X, and features a dual-core processor with a maximum clock speed of 1.5 GHz. The chip also features a 32 KB instruction cache and a 32 KB data cache.
The chip is designed to provide high performance and low power consumption, making it suitable for embedded and mobile applications. It is also designed to be compatible with a wide range of operating systems, including Windows, Linux, Android, and iOS. The chip supports a variety of memory types, including DDR3, DDR4, and LPDDR4. The chip also supports Intel’s Hyper-Threading technology, allowing for simultaneous multi-threading of applications.
The M1A3PE3000-FGG896 is designed for embedded and mobile applications, such as tablets, phones, and other handheld devices. It is also suitable for industrial and automotive applications. The chip is ideal for applications that require high performance, low power consumption, and compatibility with a wide range of operating systems. The chip is also suitable for applications that require support for multiple memory types.
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2,864 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,245.0080 | $1,245.0080 |
| 10+ | $1,231.6208 | $12,316.2084 |
| 100+ | $1,164.6849 | $116,468.4921 |
| 1000+ | $1,097.7490 | $548,874.5030 |
| 10000+ | $1,004.0387 | $1,004,038.7250 |
| The price is for reference only, please refer to the actual quotation! | ||