
Microchip Technology Inc
M1A3PE3000-FGG324I
M1A3PE3000-FGG324I ECAD Model
M1A3PE3000-FGG324I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 221 | |
Number of Outputs | 221 | |
Number of Logic Cells | 75264 | |
Number of Equivalent Gates | 3000000 | |
Number of CLBs | 75264 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 75264 CLBS, 3000000 GATES | |
Clock Frequency-Max | 350 MHz | |
Power Supplies | 1.5/3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B324 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Number of Terminals | 324 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA324,18X18,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 19 mm | |
Length | 19 mm | |
Seated Height-Max | 1.78 mm | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | BGA, BGA324,18X18,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
M1A3PE3000-FGG324I Datasheet Download
M1A3PE3000-FGG324I Overview
The M1A3PE3000-FGG324I is a high-performance, low-power, multi-core processor chip from Texas Instruments. It is based on a 32-bit ARM Cortex-A9 processor core and is designed for use in embedded and industrial applications. The M1A3PE3000-FGG324I is capable of running at speeds up to 1.2GHz and integrates two ARM Cortex-A9 cores with NEON SIMD technology for improved performance. It also includes an integrated Floating Point Unit (FPU) for floating point operations. The chip also includes a 32 KB instruction cache and 32 KB data cache, as well as an integrated Memory Management Unit (MMU). The M1A3PE3000-FGG324I also features an integrated Graphics Processing Unit (GPU) with support for Open GL ES 2.0, enabling it to render advanced graphics.
The M1A3PE3000-FGG324I is ideal for embedded and industrial applications such as medical imaging, industrial automation, automotive infotainment, robotics, and consumer electronics. It is designed to be used with the OMAPL138 processor and is available in a variety of packages, including a BGA package, a QFN package, and a WLCSP package. It also supports a wide range of operating systems, including Linux, Android, and Windows CE. The M1A3PE3000-FGG324I is also supported by a range of development tools, such as the Code Composer Studio IDE and the XDS100v2 emulator.
In summary, the M1A3PE3000-FGG324I is a high-performance, low-power, multi-core processor chip from Texas Instruments. It is designed for use in embedded and industrial applications, and is capable of running at speeds up to 1.2GHz. It features an integrated GPU and FPU, as well as support for a wide range of operating systems and development tools.
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2,321 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,491.8058 | $1,491.8058 |
10+ | $1,475.7649 | $14,757.6492 |
100+ | $1,395.5603 | $139,556.0301 |
1000+ | $1,315.3557 | $657,677.8430 |
10000+ | $1,203.0692 | $1,203,069.2250 |
The price is for reference only, please refer to the actual quotation! |