Microchip Technology Inc
M1A3PE3000-2FGG324I
M1A3PE3000-2FGG324I ECAD Model
M1A3PE3000-2FGG324I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 221 | |
| Number of Outputs | 221 | |
| Number of Logic Cells | 75264 | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 75264 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 75264 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 350 MHz | |
| Power Supplies | 1.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 1.78 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA324,18X18,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
M1A3PE3000-2FGG324I Datasheet Download
M1A3PE3000-2FGG324I Overview
The M1A3PE3000-2FGG324I is an integrated circuit (IC) chip manufactured by Altera Corporation. It is a programmable logic device (PLD) designed for high-performance applications. It is based on the Stratix III architecture, which is optimized for high-speed and low-power operation.
The M1A3PE3000-2FGG324I is a high-density, low-power PLD with an array of logic elements and embedded memory blocks. It features up to 3000 logic elements, 8 M20K blocks and 8 M4K blocks of embedded memory. It has a total of 24 independent I/O banks, with up to 36 I/O pins per bank. It is also equipped with a high-speed serial transceiver and a gigabit transceiver.
The M1A3PE3000-2FGG324I is suitable for a wide range of applications, including high-speed networking, communications, storage, and consumer electronics. Its features make it ideal for use in high-speed data processing, high-speed signal processing, and high-speed logic designs. It is also suitable for high-speed I/O expansion, such as video, audio, and Ethernet.
In summary, the M1A3PE3000-2FGG324I is a high-density, low-power PLD designed for high-performance applications. It features up to 3000 logic elements, 8 M20K blocks and 8 M4K blocks of embedded memory, and 24 independent I/O banks. It is suitable for a wide range of applications, including high-speed networking, communications, storage, and consumer electronics.
You May Also Be Interested In
4,514 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,542.6905 | $1,542.6905 |
| 10+ | $1,526.1024 | $15,261.0244 |
| 100+ | $1,443.1621 | $144,316.2090 |
| 1000+ | $1,360.2217 | $680,110.8700 |
| 10000+ | $1,244.1053 | $1,244,105.2500 |
| The price is for reference only, please refer to the actual quotation! | ||