M1A3PE3000-1FG484
M1A3PE3000-1FG484
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rohs

Microchip Technology Inc

M1A3PE3000-1FG484


M1A3PE3000-1FG484
F8-M1A3PE3000-1FG484
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA484,22X22,40
BGA, BGA484,22X22,40

M1A3PE3000-1FG484 ECAD Model


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M1A3PE3000-1FG484 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.5 V
Number of Inputs 341
Number of Outputs 341
Number of Logic Cells 75264
Number of Equivalent Gates 3000000
Number of CLBs 75264
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 75264 CLBS, 3000000 GATES
Clock Frequency-Max 350 MHz
Power Supplies 1.5/3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.44 mm
Ihs Manufacturer MICROSEMI CORP
Package Description BGA, BGA484,22X22,40
Reach Compliance Code unknown
HTS Code 8542.39.00.01

M1A3PE3000-1FG484 Datasheet Download


M1A3PE3000-1FG484 Overview



The M1A3PE3000-1FG484 is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. This chip is designed to support high-performance applications that require high-speed data processing. It is a 3D stacked FPGA that is built on a 28nm process technology. It has a total of 4,844,608 logic cells and a total of 594,944 flip-flops. It also has up to 4,096 DSP slices, and up to 4,096 block RAMs.


This chip is designed for applications that require high-speed data processing and high-performance computing. It is suitable for applications such as data centers, machine learning, artificial intelligence, autonomous driving, networking, and 5G. It is also suitable for embedded applications such as industrial automation, medical imaging, and robotics.


The M1A3PE3000-1FG484 chip has a number of features that make it suitable for these applications. It has an integrated PCIe Gen3 x16 interface and a DDR4-3200 memory interface. It also has a high-speed transceiver for high-speed data transfer. It has a total of 12 high-speed SERDES transceivers and a total of 12 GTP transceivers. It also has a total of 8 high-speed I/O banks.


The M1A3PE3000-1FG484 chip is designed to be power efficient and reliable. It has a low power consumption of 6W, and it is designed to operate in temperatures ranging from -40 to +85°C. It also has a high-reliability rating of 2.4 million hours. This chip is also designed to be secure, with features such as secure boot, secure configuration, and anti-tamper protection.



2,342 In Stock


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Unit Price: $1,347.5436
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,253.2155 $1,253.2155
10+ $1,239.7401 $12,397.4011
100+ $1,172.3629 $117,236.2932
1000+ $1,104.9858 $552,492.8760
10000+ $1,010.6577 $1,010,657.7000
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