
Microchip Technology Inc
M1A3PE3000-1FG484
M1A3PE3000-1FG484 ECAD Model
M1A3PE3000-1FG484 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 341 | |
Number of Outputs | 341 | |
Number of Logic Cells | 75264 | |
Number of Equivalent Gates | 3000000 | |
Number of CLBs | 75264 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 75264 CLBS, 3000000 GATES | |
Clock Frequency-Max | 350 MHz | |
Power Supplies | 1.5/3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B484 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.44 mm | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | BGA, BGA484,22X22,40 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
M1A3PE3000-1FG484 Datasheet Download
M1A3PE3000-1FG484 Overview
The M1A3PE3000-1FG484 is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. This chip is designed to support high-performance applications that require high-speed data processing. It is a 3D stacked FPGA that is built on a 28nm process technology. It has a total of 4,844,608 logic cells and a total of 594,944 flip-flops. It also has up to 4,096 DSP slices, and up to 4,096 block RAMs.
This chip is designed for applications that require high-speed data processing and high-performance computing. It is suitable for applications such as data centers, machine learning, artificial intelligence, autonomous driving, networking, and 5G. It is also suitable for embedded applications such as industrial automation, medical imaging, and robotics.
The M1A3PE3000-1FG484 chip has a number of features that make it suitable for these applications. It has an integrated PCIe Gen3 x16 interface and a DDR4-3200 memory interface. It also has a high-speed transceiver for high-speed data transfer. It has a total of 12 high-speed SERDES transceivers and a total of 12 GTP transceivers. It also has a total of 8 high-speed I/O banks.
The M1A3PE3000-1FG484 chip is designed to be power efficient and reliable. It has a low power consumption of 6W, and it is designed to operate in temperatures ranging from -40 to +85°C. It also has a high-reliability rating of 2.4 million hours. This chip is also designed to be secure, with features such as secure boot, secure configuration, and anti-tamper protection.
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2,342 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,253.2155 | $1,253.2155 |
10+ | $1,239.7401 | $12,397.4011 |
100+ | $1,172.3629 | $117,236.2932 |
1000+ | $1,104.9858 | $552,492.8760 |
10000+ | $1,010.6577 | $1,010,657.7000 |
The price is for reference only, please refer to the actual quotation! |