
Microchip Technology Inc
M1A3PE1500-FGG676
M1A3PE1500-FGG676 ECAD Model
M1A3PE1500-FGG676 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 444 | |
Number of Outputs | 444 | |
Number of Logic Cells | 38400 | |
Number of Equivalent Gates | 1500000 | |
Number of CLBs | 38400 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 38400 CLBS, 1500000 GATES | |
Clock Frequency-Max | 350 MHz | |
Power Supplies | 1.5/3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.44 mm | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | BGA, BGA676,26X26,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
M1A3PE1500-FGG676 Datasheet Download
M1A3PE1500-FGG676 Overview
The M1A3PE1500-FGG676 is a high-performance, low-power, multi-core processor chip designed by Fujitsu. It is based on the ARM Cortex-A15 MPCore architecture and is fabricated using a 28nm process technology. It has four ARM Cortex-A15 cores, each running at 1.5 GHz, and a two-channel DDR3/DDR3L memory controller. The chip also supports a wide range of peripherals, including USB 2.0, SATA 3.0, PCIe 3.0, and Gigabit Ethernet.
The M1A3PE1500-FGG676 is designed to provide high levels of performance, scalability, and reliability. It has an integrated floating point unit (FPU) and a vector floating point unit (VFP) for high-performance computing. It also features a high-bandwidth cache hierarchy, allowing for fast data access and low latency. The chip is designed to support a wide range of operating systems, including Linux, Android, and Windows.
The M1A3PE1500-FGG676 is ideal for a variety of embedded applications, including industrial automation, medical imaging, automotive infotainment, and digital signage. It is also suitable for applications that require high performance and low power consumption, such as mobile devices, tablets, and wearables. The chip is also well-suited for cloud computing, data centers, and server environments.
Overall, the M1A3PE1500-FGG676 is a powerful, low-power, multi-core processor chip that is suitable for a wide range of applications. It offers high levels of performance, scalability, and reliability, and is ideal for embedded, mobile, and cloud computing applications.
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4,105 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $242.2764 | $242.2764 |
10+ | $239.6713 | $2,396.7132 |
100+ | $226.6457 | $22,664.5701 |
1000+ | $213.6201 | $106,810.0430 |
10000+ | $195.3842 | $195,384.2250 |
The price is for reference only, please refer to the actual quotation! |