Microchip Technology Inc
M1A3P600-FGG144
M1A3P600-FGG144 ECAD Model
M1A3P600-FGG144 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 600000 | |
| Number of CLBs | 13824 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 13824 CLBS, 600000 GATES | |
| Clock Frequency-Max | 350 MHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm | |
| Length | 13 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | LBGA, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
M1A3P600-FGG144 Datasheet Download
M1A3P600-FGG144 Overview
The M1A3P600-FGG144 is a high-performance, low-power Field Programmable Gate Array (FPGA) chip model developed by Microsemi. It is designed to deliver superior performance in a wide variety of applications, including embedded systems, aerospace and defense, industrial and medical, communications, and automotive.
The chip model is based on the M1A3P600 architecture, which is a high-performance, low-power, high-density FPGA. It has a total of 144K logic elements, 6,400 flip-flops and 6,400 RAM blocks. It also has 18 dedicated multipliers, two dedicated DSP blocks, and up to 8.2 million system gates. The chip model is capable of operating at up to 600 MHz and has a wide range of I/O options, including LVDS, LVCMOS, and SSTL2.
The M1A3P600-FGG144 is designed to deliver high performance, low power consumption, and reliable operation. It is suitable for a wide range of applications, including embedded systems, aerospace and defense, industrial and medical, communications, and automotive. It is also ideal for applications that require high-performance, low-power, and high-density FPGA solutions. The chip model is also ideal for applications that require high-speed data processing, signal processing, and communications.
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3,340 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $57.6641 | $57.6641 |
| 10+ | $57.0440 | $570.4405 |
| 100+ | $53.9438 | $5,394.3828 |
| 1000+ | $50.8436 | $25,421.8040 |
| 10000+ | $46.5033 | $46,503.3000 |
| The price is for reference only, please refer to the actual quotation! | ||