M1A3P600-FG256
M1A3P600-FG256
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rohs

Microchip Technology Inc

M1A3P600-FG256


M1A3P600-FG256
F8-M1A3P600-FG256
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

M1A3P600-FG256 ECAD Model


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M1A3P600-FG256 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.5 V
Number of Equivalent Gates 600000
Number of CLBs 13824
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 13824 CLBS, 600000 GATES
Clock Frequency-Max 350 MHz
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 1.8 mm
Ihs Manufacturer MICROSEMI CORP
Package Description BGA,
Reach Compliance Code unknown
HTS Code 8542.39.00.01

M1A3P600-FG256 Datasheet Download


M1A3P600-FG256 Overview



The M1A3P600-FG256 is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a mid-range device in the Xilinx Spartan-3E series. The chip has a total of 600 logic slices, each containing four 6-input look-up tables (LUTs) and 16 flip-flops. It also has 18 dedicated multipliers, 18 dedicated Digital Signal Processing (DSP) blocks, and a total of 256Kbits of embedded RAM. The device is designed to work with a 3.3V power supply and has a maximum operating frequency of 250MHz.


The M1A3P600-FG256 is suitable for a wide range of applications including embedded control, image and video processing, networking, and communications. It is capable of implementing complex algorithms such as convolution, FFT, and FIR filtering. The device is also well-suited for high-speed data acquisition, high-speed signal processing, and high-speed serial communication.


The M1A3P600-FG256 is available in a 256-pin Fine-pitch Ball Grid Array (FBGA) package. It is also RoHS compliant, making it suitable for use in lead-free applications. The device is supported by Xilinx’s ISE Design Suite and Vivado Design Suite, allowing users to quickly develop and deploy applications on the chip.



1,645 In Stock


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Unit Price: $46.1483
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Pricing (USD)

QTY Unit Price Ext Price
1+ $42.9179 $42.9179
10+ $42.4564 $424.5644
100+ $40.1490 $4,014.9021
1000+ $37.8416 $18,920.8030
10000+ $34.6112 $34,611.2250
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