Microchip Technology Inc
M1A3P1000L-FGG144I
M1A3P1000L-FGG144I ECAD Model
M1A3P1000L-FGG144I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 97 | |
| Number of Outputs | 97 | |
| Number of Logic Cells | 24576 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 24576 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 24576 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 350 MHz | |
| Power Supplies | 1.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA144,12X12,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm | |
| Length | 13 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | LBGA, BGA144,12X12,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
M1A3P1000L-FGG144I Datasheet Download
M1A3P1000L-FGG144I Overview
The M1A3P1000L-FGG144I is an integrated circuit (IC) chip produced by the semiconductor manufacturer STMicroelectronics. It is a low-power, high-performance, multi-core microcontroller with a 32-bit ARM Cortex-M3 processor core. The M1A3P1000L-FGG144I is a 144-pin, low-power device that is suitable for use in embedded applications.
The chip contains 64KB of ROM, 32KB of SRAM, and 4KB of EEPROM, as well as a variety of peripheral interfaces, including two UARTs, two I2C, one SPI, and one CAN. It also has a 12-bit A/D converter, a 10-bit D/A converter, and a PWM timer. The chip operates at a frequency of up to 72 MHz and has a power consumption of just 0.4 mW/MHz.
The M1A3P1000L-FGG144I is ideal for applications that require low-power operation, such as automotive, consumer, industrial, and medical applications. It is also suitable for use in applications that require high performance, such as digital signal processing, communications, and control systems.
The chip has a wide range of features, such as low-power modes, sleep and standby modes, and advanced power management. It also has a wide operating temperature range of -40°C to +85°C. The M1A3P1000L-FGG144I is available in a variety of packages, including LQFP, QFN, and BGA.
You May Also Be Interested In
4,784 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $201.9138 | $201.9138 |
| 10+ | $199.7427 | $1,997.4267 |
| 100+ | $188.8871 | $18,888.7092 |
| 1000+ | $178.0315 | $89,015.7560 |
| 10000+ | $162.8337 | $162,833.7000 |
| The price is for reference only, please refer to the actual quotation! | ||