Microchip Technology Inc
M1A3P1000L-1FGG256
M1A3P1000L-1FGG256 ECAD Model
M1A3P1000L-1FGG256 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 177 | |
| Number of Outputs | 177 | |
| Number of Logic Cells | 24576 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 24576 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 24576 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 350 MHz | |
| Power Supplies | 1.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.8 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
M1A3P1000L-1FGG256 Datasheet Download
M1A3P1000L-1FGG256 Overview
The M1A3P1000L-1FGG256 is a Field Programmable Gate Array (FPGA) chip model from Altera Corporation. This chip is part of the Stratix III family of FPGAs, and is designed to provide users with high-performance, high-density logic and memory capabilities.
The M1A3P1000L-1FGG256 chip has a total of 256 I/O pins, and is capable of providing up to 1000 Logic Elements (LEs). It has a total of 1.3 million system gates, and an embedded memory of up to 1.3Mbits. This chip also features a low-power, low-noise design, and is capable of operating at temperatures ranging from -40°C to +85°C.
This chip is suitable for use in a variety of applications, such as data acquisition, embedded control, and communications. It can also be used in applications such as high-speed networking, video processing, and image processing.
The M1A3P1000L-1FGG256 chip offers a high-performance, low-power solution for a variety of applications. It is capable of providing up to 1000 LEs and 1.3 million system gates, with an embedded memory of up to 1.3Mbits. It is suitable for use in a variety of applications, including data acquisition, embedded control, and communications.
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3,294 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $140.3366 | $140.3366 |
| 10+ | $138.8276 | $1,388.2763 |
| 100+ | $131.2827 | $13,128.2652 |
| 1000+ | $123.7377 | $61,868.8360 |
| 10000+ | $113.1747 | $113,174.7000 |
| The price is for reference only, please refer to the actual quotation! | ||