
Microchip Technology Inc
M1A3P1000-FGG256I
M1A3P1000-FGG256I ECAD Model
M1A3P1000-FGG256I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.5 V | |
Number of Equivalent Gates | 1000000 | |
Number of CLBs | 24576 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 24576 CLBS, 1000000 GATES | |
Clock Frequency-Max | 350 MHz | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 1.8 mm | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | BGA, | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
M1A3P1000-FGG256I Datasheet Download
M1A3P1000-FGG256I Overview
The M1A3P1000-FGG256I chip model is a high-performance, cost-effective, low-power Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It is based on the Lattice MachXO3LF family of FPGAs and is designed to provide a flexible, scalable and reliable platform for a wide range of applications.
The M1A3P1000-FGG256I chip model offers a wide range of features including a high-performance, low-power and low-cost FPGA fabric, up to 256Kbits of SRAM, up to 8Kbits of EEPROM, up to 256Kbits of Flash memory and a wide range of I/O options. It also features a wide range of features such as a high-speed, low-latency differential I/O, a high-speed and low-power LVDS interface, a wide variety of I/O options, and a wide range of I/O expansion options.
The M1A3P1000-FGG256I chip model is suitable for a wide range of applications, including industrial automation, automotive, medical, consumer electronics, aerospace, defense, and communications. Its low power consumption and low cost make it ideal for applications where cost and power are critical factors. Its wide range of features makes it suitable for a wide range of applications, including high-speed, low-latency communication, high-speed data processing, high-speed image processing, and high-speed signal processing.
In summary, the M1A3P1000-FGG256I chip model is a high-performance, cost-effective, low-power FPGA from Lattice Semiconductor, suitable for a wide range of applications. It features a high-performance, low-power and low-cost FPGA fabric, up to 256Kbits of SRAM, up to 8Kbits of EEPROM, up to 256Kbits of Flash memory and a wide range of I/O options. It is suitable for applications where cost and power are critical factors, and its wide range of features makes it suitable for a wide range of applications.
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2,318 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $283.7350 | $283.7350 |
10+ | $280.6841 | $2,806.8409 |
100+ | $265.4295 | $26,542.9518 |
1000+ | $250.1749 | $125,087.4740 |
10000+ | $228.8186 | $228,818.5500 |
The price is for reference only, please refer to the actual quotation! |