M1A3P1000-FGG256
M1A3P1000-FGG256
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rohs

Microchip Technology Inc

M1A3P1000-FGG256


M1A3P1000-FGG256
F8-M1A3P1000-FGG256
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

M1A3P1000-FGG256 ECAD Model


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M1A3P1000-FGG256 Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.5 V
Number of Equivalent Gates 1000000
Number of CLBs 24576
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 24576 CLBS, 1000000 GATES
Clock Frequency-Max 350 MHz
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 1.8 mm
Ihs Manufacturer MICROSEMI CORP
Package Description BGA,
Reach Compliance Code compliant
HTS Code 8542.39.00.01

M1A3P1000-FGG256 Datasheet Download


M1A3P1000-FGG256 Overview



The M1A3P1000-FGG256 is a high-performance, low-power Field Programmable Gate Array (FPGA) chip designed by the semiconductor manufacturer Xilinx. It is based on their UltraScale+ architecture and features a combination of logic, memory, and digital signal processing (DSP) blocks. The chip has a total of 256K logic cells and 8.1Mb of embedded RAM, and is suitable for a wide range of applications.


The chip has a total power consumption of less than 10W, making it suitable for use in portable devices and embedded systems. It also has a range of other features, such as a high-speed transceiver, a low-jitter clock, and an integrated phase-locked loop (PLL). The chip supports a wide range of I/O standards, including LVDS, LVCMOS, and SSTL.


The M1A3P1000-FGG256 is suitable for a range of applications, including high-performance computing, networking, and storage. It is also suitable for applications in the automotive, industrial, and medical sectors. The chip is designed to be highly configurable, allowing users to tailor the device to their specific application requirements.


In summary, the M1A3P1000-FGG256 is a high-performance, low-power FPGA chip designed by Xilinx. It has a total of 256K logic cells and 8.1Mb of embedded RAM, and is suitable for a wide range of applications. The chip has a low power consumption and a range of features, such as a high-speed transceiver, a low-jitter clock, and an integrated phase-locked loop (PLL). It is suitable for a range of applications, including high-performance computing, networking, and storage.



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Unit Price: $232.1233
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Pricing (USD)

QTY Unit Price Ext Price
1+ $215.8747 $215.8747
10+ $213.5534 $2,135.5344
100+ $201.9473 $20,194.7271
1000+ $190.3411 $95,170.5530
10000+ $174.0925 $174,092.4750
The price is for reference only, please refer to the actual quotation!

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