
Microchip Technology Inc
M1A3P1000-FGG256
M1A3P1000-FGG256 ECAD Model
M1A3P1000-FGG256 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.5 V | |
Number of Equivalent Gates | 1000000 | |
Number of CLBs | 24576 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 24576 CLBS, 1000000 GATES | |
Clock Frequency-Max | 350 MHz | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 1.8 mm | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | BGA, | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
M1A3P1000-FGG256 Datasheet Download
M1A3P1000-FGG256 Overview
The M1A3P1000-FGG256 is a high-performance, low-power Field Programmable Gate Array (FPGA) chip designed by the semiconductor manufacturer Xilinx. It is based on their UltraScale+ architecture and features a combination of logic, memory, and digital signal processing (DSP) blocks. The chip has a total of 256K logic cells and 8.1Mb of embedded RAM, and is suitable for a wide range of applications.
The chip has a total power consumption of less than 10W, making it suitable for use in portable devices and embedded systems. It also has a range of other features, such as a high-speed transceiver, a low-jitter clock, and an integrated phase-locked loop (PLL). The chip supports a wide range of I/O standards, including LVDS, LVCMOS, and SSTL.
The M1A3P1000-FGG256 is suitable for a range of applications, including high-performance computing, networking, and storage. It is also suitable for applications in the automotive, industrial, and medical sectors. The chip is designed to be highly configurable, allowing users to tailor the device to their specific application requirements.
In summary, the M1A3P1000-FGG256 is a high-performance, low-power FPGA chip designed by Xilinx. It has a total of 256K logic cells and 8.1Mb of embedded RAM, and is suitable for a wide range of applications. The chip has a low power consumption and a range of features, such as a high-speed transceiver, a low-jitter clock, and an integrated phase-locked loop (PLL). It is suitable for a range of applications, including high-performance computing, networking, and storage.
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Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $215.8747 | $215.8747 |
10+ | $213.5534 | $2,135.5344 |
100+ | $201.9473 | $20,194.7271 |
1000+ | $190.3411 | $95,170.5530 |
10000+ | $174.0925 | $174,092.4750 |
The price is for reference only, please refer to the actual quotation! |