Microchip Technology Inc
M1A3P1000-1FGG484
M1A3P1000-1FGG484 ECAD Model
M1A3P1000-1FGG484 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 24576 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 24576 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 350 MHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
M1A3P1000-1FGG484 Datasheet Download
M1A3P1000-1FGG484 Overview
The M1A3P1000-1FGG484 is a Field Programmable Gate Array (FPGA) chip from Xilinx. It is a high-performance, low-power FPGA device with advanced features such as high-speed transceivers, integrated memory blocks, and a wide range of I/O options. The chip has a total of 1,000 logic cells, with each cell containing 4 input and 4 output pins. The chip is powered by a 3.3V supply and has a maximum power consumption of 1.5W.
The chip has a wide range of I/O options, including LVDS, LVCMOS, and SSTL interfaces, as well as support for up to 32 differential pairs of high-speed transceivers. It also has an integrated memory block of up to 1,024 Kbits of RAM. The chip is available in a 484-ball BGA package, with a maximum operating temperature of 85°C.
The M1A3P1000-1FGG484 is suitable for a wide range of applications, including high-speed communication, image processing, video processing, and embedded systems. It is also suitable for use in automotive and medical applications, due to its low power consumption and wide range of I/O options. The chip is also suitable for use in high-performance computing applications, due to its high-speed transceivers, integrated memory blocks, and wide range of I/O options.
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1,405 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $82.5077 | $82.5077 |
| 10+ | $81.6206 | $816.2056 |
| 100+ | $77.1847 | $7,718.4660 |
| 1000+ | $72.7488 | $36,374.3800 |
| 10000+ | $66.5385 | $66,538.5000 |
| The price is for reference only, please refer to the actual quotation! | ||