
Microchip Technology Inc
M1A3P1000-1FGG256I
M1A3P1000-1FGG256I ECAD Model
M1A3P1000-1FGG256I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.5 V | |
Number of Equivalent Gates | 1000000 | |
Number of CLBs | 24576 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 24576 CLBS, 1000000 GATES | |
Clock Frequency-Max | 350 MHz | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 1.8 mm | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | BGA, | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
M1A3P1000-1FGG256I Datasheet Download
M1A3P1000-1FGG256I Overview
The M1A3P1000-1FGG256I chip model is a high-performance, low-power, low-cost FPGA (Field Programmable Gate Array) manufactured by Xilinx. It is a small, single-chip FPGA solution that is ideal for a wide range of applications. The M1A3P1000-1FGG256I chip model is based on the Xilinx Virtex-1 family of FPGAs and offers a wide range of features, including up to 256 I/O pins, up to 1 million system gates, up to 1 Gb/s data transfer rate, up to 100 MHz clock speed, and up to 1.2V power supply.
The M1A3P1000-1FGG256I chip model is a highly versatile FPGA solution that can be used in a variety of applications, including embedded systems, digital signal processing, communications, industrial automation, automotive, and aerospace. It is suitable for applications requiring high-speed and low-power solutions, such as in video processing, image processing, and data acquisition. Additionally, the chip model can be used in high-performance computing solutions, such as in networking and storage applications.
The M1A3P1000-1FGG256I chip model is designed for easy integration into existing systems and offers a wide range of features, including programmable logic, high-speed I/O, and memory interface support. It is also designed to be highly reliable and offers a wide range of safety and security features, including advanced error correction and detection. Additionally, the chip model is designed to be highly scalable and can be used in a variety of configurations, allowing for easy customization.
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1,061 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $309.0253 | $309.0253 |
10+ | $305.7025 | $3,057.0248 |
100+ | $289.0882 | $28,908.8211 |
1000+ | $272.4739 | $136,236.9730 |
10000+ | $249.2140 | $249,213.9750 |
The price is for reference only, please refer to the actual quotation! |