Microchip Technology Inc
AX250-FGG484M
AX250-FGG484M ECAD Model
AX250-FGG484M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 248 | |
| Number of Outputs | 248 | |
| Number of Logic Cells | 4224 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 2816 | |
| Combinatorial Delay of a CLB-Max | 990 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-STD-883 Class B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2816 CLBS, 250000 GATES | |
| Additional Feature | 250000 SYSTEM GATES AVAILABLE | |
| Clock Frequency-Max | 649 MHz | |
| Power Supplies | 1.5,1.5/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA484,22X22,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
AX250-FGG484M Datasheet Download
AX250-FGG484M Overview
The AX250-FGG484M is a high-performance, low-power System on Chip (SoC) manufactured by Advanced Micro Devices (AMD). It is designed for embedded applications such as automotive, industrial, and medical, and is suitable for a wide range of applications.
The AX250-FGG484M is a single-chip solution for embedded systems, integrating a high-performance processor core, memory controller, and peripheral controllers. It is based on the AMD's Zen 2 core architecture and is built on a 7nm process. It has a maximum clock speed of up to 3.6GHz and a maximum power consumption of up to 15W. It also features a wide range of integrated features such as a DDR4 memory controller, PCIe 3.0 controller, USB 3.1 Gen 2 controller, and SATA 3 controller.
The AX250-FGG484M supports a wide range of operating systems, including Linux, Windows 10, and Android. It also supports a wide range of development tools, including the AMD OpenCL SDK, AMD FPGA SDK, and AMD GPU SDK.
The AX250-FGG484M is an ideal solution for embedded applications such as automotive, industrial, and medical. It is capable of providing high performance and low power consumption, making it suitable for a wide range of applications. It is also highly scalable and can be used in a wide range of applications, from simple to complex.
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5,590 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,748.8652 | $3,748.8652 |
| 10+ | $3,708.5549 | $37,085.5487 |
| 100+ | $3,507.0030 | $350,700.2973 |
| 1000+ | $3,305.4511 | $1,652,725.5390 |
| 10000+ | $3,023.2784 | $3,023,278.4250 |
| The price is for reference only, please refer to the actual quotation! | ||