AX250-FGG256M
AX250-FGG256M
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rohs

Microchip Technology Inc

AX250-FGG256M


AX250-FGG256M
F8-AX250-FGG256M
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA, BGA256,16X16,40
LBGA, BGA256,16X16,40

AX250-FGG256M ECAD Model


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AX250-FGG256M Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.5 V
Number of Inputs 248
Number of Outputs 248
Number of Logic Cells 4224
Number of Equivalent Gates 250000
Number of CLBs 2816
Combinatorial Delay of a CLB-Max 990 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Screening Level MIL-STD-883 Class B
Temperature Grade MILITARY
Package Shape SQUARE
Technology CMOS
Organization 2816 CLBS, 250000 GATES
Additional Feature 250000 SYSTEM GATES AVAILABLE
Clock Frequency-Max 649 MHz
Power Supplies 1.5,1.5/3.3,2.5/3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer MICROSEMI CORP
Package Description LBGA, BGA256,16X16,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A001.A.2.C

AX250-FGG256M Datasheet Download


AX250-FGG256M Overview



The AX250-FGG256M is a Field Programmable Gate Array (FPGA) chip manufactured by the company Xilinx. It is a low-cost, low-power device that is ideal for applications where a small footprint and low power consumption are required. It is based on the Xilinx Spartan-6 FPGA architecture and is available in a variety of packages, including a 256-pin BGA package.


The AX250-FGG256M offers up to 250,000 logic cells and up to 1.4 million system gates. It also has up to 4,096 Kbits of block RAM. It is equipped with up to 8 DSP slices, up to 64 user I/Os, and up to 5 clock management tiles. It also supports multiple power supplies and is able to operate at temperatures ranging from -40°C to +85°C.


The AX250-FGG256M is suitable for a wide range of applications, including embedded systems, industrial automation, automotive, consumer electronics, medical, and aerospace. It can be used for image processing, data acquisition, and control systems. It is also suitable for applications that require high-speed data transfer and low-power operation.


In summary, the AX250-FGG256M is a low-cost, low-power FPGA chip that is suitable for a wide range of applications. It offers up to 250,000 logic cells and up to 1.4 million system gates, as well as up to 8 DSP slices, up to 64 user I/Os, and up to 5 clock management tiles. It is able to operate at temperatures ranging from -40°C to +85°C and is ideal for applications that require high-speed data transfer and low-power operation.



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QTY Unit Price Ext Price
1+ $1,028.9743 $1,028.9743
10+ $1,017.9101 $10,179.1008
100+ $962.5889 $96,258.8880
1000+ $907.2677 $453,633.8400
10000+ $829.8180 $829,818.0000
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