
Microchip Technology Inc
AX250-FGG256M
AX250-FGG256M ECAD Model
AX250-FGG256M Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 248 | |
Number of Outputs | 248 | |
Number of Logic Cells | 4224 | |
Number of Equivalent Gates | 250000 | |
Number of CLBs | 2816 | |
Combinatorial Delay of a CLB-Max | 990 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Screening Level | MIL-STD-883 Class B | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2816 CLBS, 250000 GATES | |
Additional Feature | 250000 SYSTEM GATES AVAILABLE | |
Clock Frequency-Max | 649 MHz | |
Power Supplies | 1.5,1.5/3.3,2.5/3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | LBGA, BGA256,16X16,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A001.A.2.C |
AX250-FGG256M Datasheet Download
AX250-FGG256M Overview
The AX250-FGG256M is a Field Programmable Gate Array (FPGA) chip manufactured by the company Xilinx. It is a low-cost, low-power device that is ideal for applications where a small footprint and low power consumption are required. It is based on the Xilinx Spartan-6 FPGA architecture and is available in a variety of packages, including a 256-pin BGA package.
The AX250-FGG256M offers up to 250,000 logic cells and up to 1.4 million system gates. It also has up to 4,096 Kbits of block RAM. It is equipped with up to 8 DSP slices, up to 64 user I/Os, and up to 5 clock management tiles. It also supports multiple power supplies and is able to operate at temperatures ranging from -40°C to +85°C.
The AX250-FGG256M is suitable for a wide range of applications, including embedded systems, industrial automation, automotive, consumer electronics, medical, and aerospace. It can be used for image processing, data acquisition, and control systems. It is also suitable for applications that require high-speed data transfer and low-power operation.
In summary, the AX250-FGG256M is a low-cost, low-power FPGA chip that is suitable for a wide range of applications. It offers up to 250,000 logic cells and up to 1.4 million system gates, as well as up to 8 DSP slices, up to 64 user I/Os, and up to 5 clock management tiles. It is able to operate at temperatures ranging from -40°C to +85°C and is ideal for applications that require high-speed data transfer and low-power operation.
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4,418 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,028.9743 | $1,028.9743 |
10+ | $1,017.9101 | $10,179.1008 |
100+ | $962.5889 | $96,258.8880 |
1000+ | $907.2677 | $453,633.8400 |
10000+ | $829.8180 | $829,818.0000 |
The price is for reference only, please refer to the actual quotation! |