Microchip Technology Inc
AX250-FGG256I
AX250-FGG256I ECAD Model
AX250-FGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 248 | |
| Number of Outputs | 248 | |
| Number of Logic Cells | 4224 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 2816 | |
| Combinatorial Delay of a CLB-Max | 990 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2816 CLBS, 250000 GATES | |
| Additional Feature | 250000 SYSTEM GATES AVAILABLE | |
| Clock Frequency-Max | 649 MHz | |
| Power Supplies | 1.5,1.5/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | LBGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
AX250-FGG256I Datasheet Download
AX250-FGG256I Overview
The AX250-FGG256I is a Field Programmable Gate Array (FPGA) chip from Lattice Semiconductor. It is a low-cost, low-power, high-performance FPGA with a wide range of applications. The chip has an internal architecture that consists of 256 I/O pins and up to 256Kbits of embedded SRAM. It is designed to be used in a variety of applications, including embedded systems, communications, medical, industrial, automotive, and consumer electronics.
The AX250-FGG256I has a wide range of features that make it suitable for a variety of applications. It has a high-performance, low-power architecture with an integrated power management system. It also has an integrated clock management system, allowing for low-power and high-performance operation. It also has an integrated memory controller for embedded SRAM, allowing for fast access to data. Additionally, the chip supports a variety of interfaces, including USB, Ethernet, and CAN.
The AX250-FGG256I is also designed for ease of use and flexibility. It has an intuitive graphical user interface for programming and debugging, and it supports a variety of development tools. Additionally, the chip is designed to be used in a variety of development environments, including Linux, Windows, and Mac OS.
In conclusion, the AX250-FGG256I is a low-cost, low-power, high-performance FPGA with a wide range of applications. It has an integrated power management system, clock management system, and memory controller, as well as a variety of interfaces and development tools. It is designed for ease of use and flexibility, making it suitable for a variety of applications.
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5,990 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1.9270 | $1.9270 |
| 10+ | $1.9062 | $19.0624 |
| 100+ | $1.8026 | $180.2640 |
| 1000+ | $1.6990 | $849.5200 |
| 10000+ | $1.5540 | $1,554.0000 |
| The price is for reference only, please refer to the actual quotation! | ||