
Microchip Technology Inc
AX250-FGG256
AX250-FGG256 ECAD Model
AX250-FGG256 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 248 | |
Number of Outputs | 248 | |
Number of Logic Cells | 4224 | |
Number of Equivalent Gates | 250000 | |
Number of CLBs | 2816 | |
Combinatorial Delay of a CLB-Max | 990 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2816 CLBS, 250000 GATES | |
Additional Feature | 250000 SYSTEM GATES AVAILABLE | |
Clock Frequency-Max | 649 MHz | |
Power Supplies | 1.5,1.5/3.3,2.5/3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | LBGA, BGA256,16X16,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
AX250-FGG256 Datasheet Download
AX250-FGG256 Overview
The AX250-FGG256 is a Field Programmable Gate Array (FPGA) chip from Xilinx. It is a high-performance, low-power programmable logic device with a rich set of features. It is designed to be used in a variety of applications, including digital signal processing, embedded systems, and system-on-chip designs.
The AX250-FGG256 has a total of 256 logic cells, each of which is composed of four look-up tables (LUTs) and four flip-flops. It also has 16 dedicated I/O blocks, which can be configured to support various types of I/O standards, such as LVDS, SSTL, and HSTL. The chip has a total of 6,144 bits of block RAM, which can be used for storing data and instructions. It also has a dedicated DSP block, which can be used for floating-point operations.
The AX250-FGG256 supports a wide range of clock frequencies, ranging from 100MHz to 400MHz. It has a total power consumption of less than 3W, making it ideal for battery-powered applications. It also has a wide operating temperature range, from -40°C to +85°C.
The AX250-FGG256 is suitable for a wide range of applications, including industrial automation, medical imaging, aerospace, automotive, and consumer electronics. It can be used to implement custom logic designs, and can also be used to accelerate the performance of existing designs. It is also suitable for applications that require high levels of integration, such as digital signal processing and embedded systems.
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5,515 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $158.3939 | $158.3939 |
10+ | $156.6907 | $1,566.9072 |
100+ | $148.1749 | $14,817.4920 |
1000+ | $139.6591 | $69,829.5600 |
10000+ | $127.7370 | $127,737.0000 |
The price is for reference only, please refer to the actual quotation! |