Microchip Technology Inc
AX250-1FGG256M
AX250-1FGG256M ECAD Model
AX250-1FGG256M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 248 | |
| Number of Outputs | 248 | |
| Number of Logic Cells | 4224 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 2816 | |
| Combinatorial Delay of a CLB-Max | 840 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-STD-883 Class B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2816 CLBS, 250000 GATES | |
| Additional Feature | 250000 SYSTEM GATES AVAILABLE | |
| Clock Frequency-Max | 763 MHz | |
| Power Supplies | 1.5,1.5/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | LBGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
AX250-1FGG256M Datasheet Download
AX250-1FGG256M Overview
The AX250-1FGG256M is a high-performance, low-power, multi-chip module (MCM) designed for use in a variety of applications. It is based on a 16-bit RISC processor core, and incorporates two 256Mb (1Gbit) DDR2 SDRAMs, two 16-bit Flash memories, and two 16-bit static RAMs. It also features an integrated USB 2.0 interface, a 32-bit PCI bus, and an 8-bit I/O port.
The AX250-1FGG256M is designed to provide high performance, low power consumption, and high reliability. It is capable of operating at up to 200MHz, and can support up to 32GB of memory. It also features a variety of power-saving modes, such as dynamic voltage scaling, clock gating, and power gating.
The AX250-1FGG256M can be used in a variety of applications, including embedded systems, industrial automation, medical equipment, automotive, and consumer electronics. It is suitable for applications requiring high performance and low power consumption. It is also suitable for applications requiring large amounts of data storage and retrieval, such as image processing and medical imaging.
The AX250-1FGG256M is a highly integrated and cost-effective solution for a wide range of applications. It is designed to provide high performance, low power consumption, and high reliability. Its features make it suitable for a variety of applications, including embedded systems, industrial automation, medical equipment, automotive, and consumer electronics.
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2,685 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,308.0859 | $1,308.0859 |
| 10+ | $1,294.0205 | $12,940.2048 |
| 100+ | $1,223.6933 | $122,369.3280 |
| 1000+ | $1,153.3661 | $576,683.0400 |
| 10000+ | $1,054.9080 | $1,054,908.0000 |
| The price is for reference only, please refer to the actual quotation! | ||