Microchip Technology Inc
AX250-1FGG256
AX250-1FGG256 ECAD Model
AX250-1FGG256 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 248 | |
| Number of Outputs | 248 | |
| Number of Logic Cells | 4224 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 2816 | |
| Combinatorial Delay of a CLB-Max | 840 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2816 CLBS, 250000 GATES | |
| Additional Feature | 250000 SYSTEM GATES AVAILABLE | |
| Clock Frequency-Max | 763 MHz | |
| Power Supplies | 1.5,1.5/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | LBGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
AX250-1FGG256 Datasheet Download
AX250-1FGG256 Overview
The AX250-1FGG256 is a low-power, high-performance Field Programmable Gate Array (FPGA) chip from Xilinx. It is a member of the Virtex family of FPGAs and is built on the 0.18μm CMOS process. The device is packaged in a 7x7mm, 256-pin Fine-Pitch Ball Grid Array (FBGA) package.
The AX250-1FGG256 FPGA contains 1 million system gates and up to 256Kbits of block RAM. It has two dedicated clock management tiles with two dedicated clock inputs, and two dedicated clock outputs. The device also includes four PLLs and two high-speed transceivers. It has a total of 250 user I/O pins, including 48 differential I/O pins.
The AX250-1FGG256 FPGA is suitable for a wide range of applications, including communications, data processing, and embedded systems. It is ideal for applications requiring high-speed, low-power operation and has a wide range of features such as low-power design, high-performance, and flexible I/O routing.
The AX250-1FGG256 FPGA is designed to be used in a variety of applications such as high-speed networking, video processing, and high-speed data acquisition systems. It is also suitable for use in automotive and aerospace applications. The device is also suitable for use in a variety of embedded applications such as medical imaging, industrial automation, and consumer electronics.
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3,988 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $205.8016 | $205.8016 |
| 10+ | $203.5886 | $2,035.8864 |
| 100+ | $192.5240 | $19,252.4040 |
| 1000+ | $181.4594 | $90,729.7200 |
| 10000+ | $165.9690 | $165,969.0000 |
| The price is for reference only, please refer to the actual quotation! | ||