
Microchip Technology Inc
AX2000-FGG896I
AX2000-FGG896I ECAD Model
AX2000-FGG896I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 684 | |
Number of Outputs | 684 | |
Number of Logic Cells | 32256 | |
Number of Equivalent Gates | 2000000 | |
Number of CLBs | 21504 | |
Combinatorial Delay of a CLB-Max | 990 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 21504 CLBS, 2000000 GATES | |
Additional Feature | 2000000 SYSTEM GATES AVAILABLE | |
Clock Frequency-Max | 649 MHz | |
Power Supplies | 1.5,1.5/3.3,2.5/3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B896 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Number of Terminals | 896 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA896,30X30,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 31 mm | |
Length | 31 mm | |
Seated Height-Max | 2.44 mm | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | BGA, BGA896,30X30,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
AX2000-FGG896I Datasheet Download
AX2000-FGG896I Overview
The AX2000-FGG896I is a programmable logic device (PLD) that is designed to meet the needs of high-end applications. It is a field-programmable gate array (FPGA) with enhanced capabilities. This chip is based on a Xilinx Virtex-II Pro FPGA architecture, providing a high-performance, high-density solution for a wide variety of applications.
The AX2000-FGG896I features a total of 9,216 logic cells, 4,608 flip-flops, and 4,608 memory blocks. It is capable of providing up to 896 Kbits of embedded RAM and up to 8,000 Kbits of distributed RAM. It also has 48 dedicated 18x18 multipliers and up to 8,000 Kbits of embedded ROM. The chip has a total of 672 I/Os, with up to 168 high-speed I/Os.
The AX2000-FGG896I is suitable for a variety of applications, including data acquisition, communications, medical imaging, digital signal processing, and embedded control. It offers a high level of flexibility and scalability, making it ideal for a wide range of applications.
In addition, the AX2000-FGG896I provides a high level of system integration, allowing for the integration of multiple components into a single chip. It is also designed to be power efficient and offers a wide range of power saving features, making it an ideal choice for applications that require low power consumption.
Overall, the AX2000-FGG896I is a high-performance, high-density PLD that is suitable for a variety of applications. It offers a high level of flexibility and scalability, as well as a wide range of system integration features. Its power efficiency makes it an ideal choice for applications that require low power consumption.
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4,670 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,795.8874 | $4,795.8874 |
10+ | $4,744.3187 | $47,443.1874 |
100+ | $4,486.4753 | $448,647.5334 |
1000+ | $4,228.6319 | $2,114,315.9620 |
10000+ | $3,867.6512 | $3,867,651.1500 |
The price is for reference only, please refer to the actual quotation! |