AX2000-FGG896I
AX2000-FGG896I
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rohs

Microchip Technology Inc

AX2000-FGG896I


AX2000-FGG896I
F8-AX2000-FGG896I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA896,30X30,40
BGA, BGA896,30X30,40

AX2000-FGG896I ECAD Model


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AX2000-FGG896I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.5 V
Number of Inputs 684
Number of Outputs 684
Number of Logic Cells 32256
Number of Equivalent Gates 2000000
Number of CLBs 21504
Combinatorial Delay of a CLB-Max 990 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 21504 CLBS, 2000000 GATES
Additional Feature 2000000 SYSTEM GATES AVAILABLE
Clock Frequency-Max 649 MHz
Power Supplies 1.5,1.5/3.3,2.5/3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B896
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 40
Number of Terminals 896
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA896,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 2.44 mm
Ihs Manufacturer MICROSEMI CORP
Package Description BGA, BGA896,30X30,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

AX2000-FGG896I Datasheet Download


AX2000-FGG896I Overview



The AX2000-FGG896I is a programmable logic device (PLD) that is designed to meet the needs of high-end applications. It is a field-programmable gate array (FPGA) with enhanced capabilities. This chip is based on a Xilinx Virtex-II Pro FPGA architecture, providing a high-performance, high-density solution for a wide variety of applications.


The AX2000-FGG896I features a total of 9,216 logic cells, 4,608 flip-flops, and 4,608 memory blocks. It is capable of providing up to 896 Kbits of embedded RAM and up to 8,000 Kbits of distributed RAM. It also has 48 dedicated 18x18 multipliers and up to 8,000 Kbits of embedded ROM. The chip has a total of 672 I/Os, with up to 168 high-speed I/Os.


The AX2000-FGG896I is suitable for a variety of applications, including data acquisition, communications, medical imaging, digital signal processing, and embedded control. It offers a high level of flexibility and scalability, making it ideal for a wide range of applications.


In addition, the AX2000-FGG896I provides a high level of system integration, allowing for the integration of multiple components into a single chip. It is also designed to be power efficient and offers a wide range of power saving features, making it an ideal choice for applications that require low power consumption.


Overall, the AX2000-FGG896I is a high-performance, high-density PLD that is suitable for a variety of applications. It offers a high level of flexibility and scalability, as well as a wide range of system integration features. Its power efficiency makes it an ideal choice for applications that require low power consumption.



4,670 In Stock


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Unit Price: $5,156.8682
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,795.8874 $4,795.8874
10+ $4,744.3187 $47,443.1874
100+ $4,486.4753 $448,647.5334
1000+ $4,228.6319 $2,114,315.9620
10000+ $3,867.6512 $3,867,651.1500
The price is for reference only, please refer to the actual quotation!

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