Microchip Technology Inc
AX2000-1FG896M
AX2000-1FG896M ECAD Model
AX2000-1FG896M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 684 | |
| Number of Outputs | 684 | |
| Number of Logic Cells | 32256 | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 21504 | |
| Combinatorial Delay of a CLB-Max | 840 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-STD-883 Class B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 21504 CLBS, 2000000 GATES | |
| Additional Feature | 2000000 SYSTEM GATES AVAILABLE | |
| Clock Frequency-Max | 763 MHz | |
| Power Supplies | 1.5,1.5/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA896,30X30,40 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
AX2000-1FG896M Datasheet Download
AX2000-1FG896M Overview
The AX2000-1FG896M is a high-performance, low-power Field Programmable Gate Array (FPGA) chip model from Xilinx. It is designed for applications in a wide range of industries, including automotive, aerospace, industrial, medical, and consumer markets. The chip is a single-chip solution that combines an FPGA, embedded memory, and a high-speed transceiver.
The chip offers a powerful combination of features and performance, including up to 896K logic cells, up to 6.1Mb of embedded memory, up to 8.8Tbps of transceiver bandwidth, and up to 1.8Tbps of I/O bandwidth. It also features a low-power architecture that enables it to operate at significantly lower power levels than other FPGA solutions.
The chip is designed to provide a range of features and performance that make it suitable for a wide range of applications. It can be used for high-speed data processing, high-speed communication, and high-speed memory access. It can also be used to implement complex algorithms, such as image processing, machine learning, and artificial intelligence.
The AX2000-1FG896M is a highly versatile chip model that can be used to develop a wide range of applications. It is capable of providing high-performance, low-power solutions for a variety of applications, making it an ideal choice for many industries.
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5,169 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $8,412.1402 | $8,412.1402 |
| 10+ | $8,321.6870 | $83,216.8704 |
| 100+ | $7,869.4214 | $786,942.1440 |
| 1000+ | $7,417.1558 | $3,708,577.9200 |
| 10000+ | $6,783.9840 | $6,783,984.0000 |
| The price is for reference only, please refer to the actual quotation! | ||