Microchip Technology Inc
AX1000-FGG676M
AX1000-FGG676M ECAD Model
AX1000-FGG676M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 516 | |
| Number of Outputs | 516 | |
| Number of Logic Cells | 18144 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 12096 | |
| Combinatorial Delay of a CLB-Max | 990 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-STD-883 Class B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 12096 CLBS, 1000000 GATES | |
| Additional Feature | 1000000 SYSTEM GATES AVAILABLE | |
| Clock Frequency-Max | 649 MHz | |
| Power Supplies | 1.5,1.5/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA676,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
AX1000-FGG676M Datasheet Download
AX1000-FGG676M Overview
The AX1000-FGG676M is a high-performance, low-power, 32-bit microcontroller chip developed by Advanced Micro Devices (AMD). It is a single-core, ARM Cortex-M0+ processor with a maximum operating frequency of up to 64 MHz. It features 16KB of Flash memory, 4KB of SRAM, and a wide range of integrated peripherals. It also supports a wide range of communication protocols, including I2C, SPI, UART, and USB.
The chip is designed for embedded applications and provides a wide range of features for system designers. It has low power consumption, making it suitable for battery-powered applications. It also supports a wide range of operating systems, including Linux, Android, and Windows.
The chip is designed for use in a variety of applications, including industrial automation, automotive, medical, and consumer electronics. It is also suitable for use in IoT, wearables, and other embedded systems. It has a wide range of features, including low power consumption, high performance, and a wide range of integrated peripherals.
The AX1000-FGG676M is a powerful and reliable chip, suitable for a wide range of embedded applications. It offers a wide range of features, including low power consumption, high performance, and a wide range of integrated peripherals. It is suitable for a variety of applications, including industrial automation, automotive, medical, and consumer electronics.
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5,722 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $9,722.4459 | $9,722.4459 |
| 10+ | $9,617.9035 | $96,179.0347 |
| 100+ | $9,095.1913 | $909,519.1323 |
| 1000+ | $8,572.4792 | $4,286,239.5890 |
| 10000+ | $7,840.6822 | $7,840,682.1750 |
| The price is for reference only, please refer to the actual quotation! | ||