APA450-FGG144I
APA450-FGG144I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Microchip Technology Inc

APA450-FGG144I


APA450-FGG144I
F8-APA450-FGG144I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA, BGA144,12X12,40
LBGA, BGA144,12X12,40

APA450-FGG144I ECAD Model


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APA450-FGG144I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 2.5 V
Number of Inputs 100
Number of Outputs 100
Number of Logic Cells 12288
Number of Equivalent Gates 450000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 450000 GATES
Clock Frequency-Max 180 MHz
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.3 V
JESD-30 Code S-PBGA-B144
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 144
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA144,12X12,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm
Length 13 mm
Seated Height-Max 1.55 mm
Ihs Manufacturer MICROSEMI CORP
Package Description LBGA, BGA144,12X12,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

APA450-FGG144I Datasheet Download


APA450-FGG144I Overview



The APA450-FGG144I is a low-power, high-performance Field Programmable Gate Array (FPGA) chip manufactured by Altera Corporation. It is designed for a variety of applications, such as embedded control, industrial automation, and communications. The chip features 144,000 logic elements, which provide up to 4,608 Kbits of embedded RAM and up to 1,152 Kbits of embedded ROM. It also has up to 9,600 user I/O pins, and is capable of operating at up to 400 MHz.


The APA450-FGG144I is built on a low-power, high-performance architecture, and is capable of implementing multiple clock domains to support high-speed data processing. It also features a low-power, high-performance DSP block, which provides up to 8,192 8-bit MACs per cycle. Additionally, the chip supports up to 16,384 user-defined I/O pins and up to 4,608 Kbits of embedded RAM, making it suitable for a wide range of applications.


The chip also features an on-chip power management unit, which allows for dynamic power management and efficient power management. This power management unit allows the chip to be used in a wide range of applications, such as embedded control, industrial automation, and communications. Additionally, the chip is designed to meet a variety of requirements, including high-speed data processing, low-power operation, and high-density I/O.


Overall, the APA450-FGG144I is a low-power, high-performance FPGA chip designed for a variety of applications. It features 144,000 logic elements, up to 9,600 user I/O pins, and is capable of operating at up to 400 MHz. Additionally, it supports multiple clock domains and a low-power, high-performance DSP block, making it suitable for a wide range of applications.



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