Microchip Technology Inc
APA450-BGG456
APA450-BGG456 ECAD Model
APA450-BGG456 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 344 | |
| Number of Outputs | 344 | |
| Number of Logic Cells | 12288 | |
| Number of Equivalent Gates | 450000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 450000 GATES | |
| Clock Frequency-Max | 180 MHz | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.54 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA456,26X26,50 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
APA450-BGG456 Datasheet Download
APA450-BGG456 Overview
The APA450-BGG456 is a high-performance, low-power, multi-function chip designed for use in a variety of applications. It is a single-die, integrated circuit (IC) that combines a variety of functions in one package.
The APA450-BGG456 is a high-performance, low-power, multi-function chip that offers a wide range of features and functions. It is a single-die, integrated circuit (IC) that combines a variety of functions in one package. It includes a high-performance, low-power, 32-bit RISC processor core, a 16-bit DSP core, a high-speed memory controller, and a variety of I/O peripherals. It also includes a wide range of analog and digital interfaces, including I2C, SPI, UART, USB, CAN, and Ethernet.
The chip is designed to enable system designers to create a wide range of embedded applications, including industrial control, automotive, consumer, and medical. It is suitable for applications that require low-power operation, high-performance, and high-speed memory access.
The APA450-BGG456 chip is designed to be highly reliable and robust, and is compliant with the RoHS (Restriction of Hazardous Substances) directive. It is also designed to support a wide range of operating systems, including Windows, Linux, and Android.
In summary, the APA450-BGG456 is a high-performance, low-power, multi-function chip designed for use in a variety of applications. It is a single-die, integrated circuit (IC) that combines a variety of functions in one package, including a high-performance, low-power, 32-bit RISC processor core, a 16-bit DSP core, a high-speed memory controller, and a variety of I/O peripherals. It is designed to enable system designers to create a wide range of embedded applications, and is compliant with the RoHS directive.
You May Also Be Interested In
4,868 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $366.9296 | $366.9296 |
| 10+ | $362.9842 | $3,629.8416 |
| 100+ | $343.2568 | $34,325.6760 |
| 1000+ | $323.5294 | $161,764.6800 |
| 10000+ | $295.9110 | $295,911.0000 |
| The price is for reference only, please refer to the actual quotation! | ||