Microchip Technology Inc
APA300-FGG144M
APA300-FGG144M ECAD Model
APA300-FGG144M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 100 | |
| Number of Outputs | 100 | |
| Number of Logic Cells | 8192 | |
| Number of Equivalent Gates | 300000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 300000 GATES | |
| Clock Frequency-Max | 180 MHz | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA144,12X12,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm | |
| Length | 13 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | LBGA, BGA144,12X12,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
APA300-FGG144M Datasheet Download
APA300-FGG144M Overview
The APA300-FGG144M is a Field Programmable Gate Array (FPGA) chip model manufactured by Altera Corporation. It is a low-power, high-performance FPGA chip designed for use in a variety of applications.
The APA300-FGG144M is based on the Arria 10 FPGA architecture and is built on a 14nm process. It has a total of 144K logic elements and a total of 5.9 million adaptive logic modules. It has a total of 7,200 Kbits of embedded memory and a total of 1,152 18x18 multipliers. It also has a total of 5,120 18x18 DSP blocks and a total of 1,152 transceivers. The chip has a total of 1,152 I/O pins and a total of 1,152 differential I/O pins.
The APA300-FGG144M is suitable for a wide range of applications, including high-performance computing, networking, storage, and industrial automation. It is also suitable for applications such as image processing, video processing, and signal processing. The APA300-FGG144M is also ideal for use in automotive, medical, and military applications.
The APA300-FGG144M is designed to be highly reliable and is capable of operating at temperatures up to 85°C. It also has a maximum power consumption of 12.5W. The chip is also designed to be highly configurable and is compatible with a wide range of software development tools.
Overall, the APA300-FGG144M is a high-performance FPGA chip that is suitable for a wide range of applications. It is designed to be reliable and highly configurable and is capable of operating at temperatures up to 85°C. It is also compatible with a wide range of software development tools.
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3,706 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,640.0953 | $1,640.0953 |
| 10+ | $1,622.4598 | $16,224.5984 |
| 100+ | $1,534.2827 | $153,428.2671 |
| 1000+ | $1,446.1055 | $723,052.7530 |
| 10000+ | $1,322.6575 | $1,322,657.4750 |
| The price is for reference only, please refer to the actual quotation! | ||