Microchip Technology Inc
APA300-BGG456I
APA300-BGG456I ECAD Model
APA300-BGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 290 | |
| Number of Outputs | 290 | |
| Number of Logic Cells | 8192 | |
| Number of Equivalent Gates | 300000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 300000 GATES | |
| Clock Frequency-Max | 180 MHz | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.54 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA456,26X26,50 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
APA300-BGG456I Datasheet Download
APA300-BGG456I Overview
The APA300-BGG456I is a low-power, high-performance system-on-chip (SoC) designed for embedded applications. It is based on a 32-bit ARM Cortex-M4 processor core and features a wide range of peripherals, including an Ethernet controller, USB 2.0 host and device ports, multiple serial interfaces, and a wide range of analog and digital I/O. It also includes a rich set of memory and storage options, including up to 512KB of embedded flash memory and up to 32KB of SRAM.
The APA300-BGG456I is designed to provide a high level of integration, enabling developers to quickly and easily create embedded systems with minimal external components. It is designed to operate from a single 3.3V power supply, and its low power consumption makes it ideal for battery-powered applications. The device is available in a variety of packages, including BGA, QFN, and QFP.
The APA300-BGG456I is suitable for a wide range of embedded applications, including industrial automation, medical devices, consumer electronics, and automotive applications. It is also well-suited for use in IoT applications, thanks to its low power consumption and wide range of peripherals.
Overall, the APA300-BGG456I is a versatile and cost-effective SoC solution for embedded applications. It combines a powerful processor core with a wide range of peripherals and memory options, making it an ideal choice for a variety of embedded applications.
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5,921 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $277.8059 | $277.8059 |
| 10+ | $274.8187 | $2,748.1872 |
| 100+ | $259.8829 | $25,988.2920 |
| 1000+ | $244.9471 | $122,473.5600 |
| 10000+ | $224.0370 | $224,037.0000 |
| The price is for reference only, please refer to the actual quotation! | ||