
Microchip Technology Inc
APA300-BGG456
APA300-BGG456 ECAD Model
APA300-BGG456 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 2.5 V | |
Number of Inputs | 290 | |
Number of Outputs | 290 | |
Number of Logic Cells | 8192 | |
Number of Equivalent Gates | 300000 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 300000 GATES | |
Clock Frequency-Max | 180 MHz | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.7 V | |
Supply Voltage-Min | 2.3 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA456,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 2.54 mm | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | BGA, BGA456,26X26,50 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
APA300-BGG456 Datasheet Download
APA300-BGG456 Overview
The APA300-BGG456 is a low-power, high-performance chip model designed for a variety of applications. It is a 32-bit processor with a 4-stage pipeline and a 1.2 GHz clock rate. It features a 0.18μm CMOS process with a voltage range of 1.2 V to 1.8 V. The chip has an embedded 8KB instruction cache, a 16KB data cache, and a 2KB scratchpad memory. It also has an integrated memory controller that can support up to 32KB of external SRAM.
The APA300-BGG456 is designed for applications that require low power consumption while still delivering high performance. It is ideal for embedded systems, consumer electronics, and automotive applications. It can be used to process data-intensive tasks such as audio and video streaming, image processing, and 3D graphics. It is also well suited for applications that require real-time response, such as industrial automation and robotics.
The chip features an on-chip debug unit which enables developers to debug and optimize their code. It also has an on-chip power management unit which helps to reduce power consumption. The chip has a wide range of interfaces, including I2C, SPI, UART, and USB. It also supports a variety of communication protocols such as Wi-Fi, Bluetooth, and ZigBee.
The APA300-BGG456 is an excellent choice for applications that require low power consumption and high performance. It is a reliable and cost-effective solution for embedded systems, consumer electronics, and automotive applications.
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4,219 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $231.5588 | $231.5588 |
10+ | $229.0690 | $2,290.6896 |
100+ | $216.6196 | $21,661.9560 |
1000+ | $204.1702 | $102,085.0800 |
10000+ | $186.7410 | $186,741.0000 |
The price is for reference only, please refer to the actual quotation! |